Gold sputtering is a technique used to deposit a thin layer of gold onto various surfaces such as circuit boards, metal jewelry, or medical implants.
This process is part of physical vapor deposition (PVD), which involves the ejection of gold atoms from a target material, typically a disc of solid gold or gold alloy, under high-energy conditions in a vacuum chamber.
5 Key Steps Explained
1. Excitation of Gold Atoms
The process begins by exciting the gold atoms in the target material.
This is achieved by bombarding the target with high-energy ions.
2. Ejection of Gold Atoms
As a result, the gold atoms are ejected or "sputtered" from the target in the form of a fine vapor.
3. Condensation onto Substrate
This vapor then condenses onto a substrate, forming a thin, even layer of gold.
4. Methods of Gold Sputtering
There are several methods to perform gold sputtering, with the most common being DC sputtering, thermal evaporation deposition, and electron-beam vapor deposition.
DC sputtering uses a direct current (DC) power source to excite the target material, making it one of the simplest and least expensive methods.
Thermal evaporation deposition involves heating the gold using an electrical resistive heating element in a low-pressure environment.
Electron-beam vapor deposition uses an electron beam to heat the gold in a high vacuum environment.
5. Specialized Equipment and Controlled Conditions
The gold sputtering process requires specialized sputtering equipment and controlled conditions to ensure the best results.
The deposited gold layer is very fine and can be controlled to create custom patterns to meet specific needs.
Additionally, sputter etching can be used to lift parts of the coating by releasing etching material from the target.
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