Lab Materials

Tin Sulfide (SnS2) Sputtering Target / Powder / Wire / Block / Granule

Name: Tin Sulfide (SnS2) Sputtering Target / Powder / Wire / Block / Granule
Brand: Kintek Solution
SKU: LM-SnS2
Rating: 4.75 (8 reviews)

Item Number : LM-SnS2

Price varies based on specs and customizations

Chemical Formula: SnS2
Purity: 4N
Shape: discs / wire / block / powder / plates / column targets / step target / custom-made

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We provide Tin Sulfide (SnS2) materials for laboratory use at affordable prices. Our expertise lies in producing and customizing Tin Sulfide (SnS2) materials of varying purities, shapes, and sizes to meet your specific needs.

Our offerings include a diverse range of sputtering targets (circular, square, tubular, irregular), coating materials, cylinders, cones, particles, foils, powders, 3D printing powders, nanometer powders, wire rods, ingots, and blocks, available in different specifications and sizes.

Details

About Tin Sulfide (SnS2)

Tin(IV) Sulfide is a versatile crystalline solid that finds applications in semiconductor and photo optic technologies. We offer a range of standard grades, including Mil Spec (military grade), ACS, Reagent and Technical Grade, Food, Agricultural and Pharmaceutical Grade, Optical Grade, and USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia), and adhere to ASTM testing standards.

We provide both typical and custom packaging options to meet your specific requirements. Our team ensures that the Tin(IV) Sulfide material we produce is of the highest quality and purity for use in your applications. Whether you need materials for semiconductor research or photo optic technologies, we've got you covered.

Ingredient Quality Control

Raw material composition analysis: Through the use of equipment such as ICP and GDMS, the content of metal impurities is detected and analyzed to ensure that it meets the purity standard;

Non-metallic impurities are detected by equipment such as carbon and sulfur analyzers, nitrogen and oxygen analyzers.
Metallographic flaw detection analysis: The target material is inspected using flaw detection equipment to ensure that there are no defects or shrinkage holes inside the product;

Through metallographic testing, the internal grain structure of the target material is analyzed to ensure that the grains are fine and dense.
Appearance and dimension inspection: Product dimensions are measured using micrometers and precision calipers to ensure compliance with drawings;

The surface finish and cleanliness of the product are measured using a surface cleanliness meter.

Conventional Sputtering Target Sizes

Preparation process: hot isostatic pressing, vacuum melting, etc.
Sputtering target shape: plane sputtering target, multi-arc sputtering target, step sputtering target, special-shaped sputtering target
Round sputtering target size: Diameter: 25.4mm / 50mm / 50.8mm / 60mm / 76.2mm / 80mm / 100mm / 101.6mm / 152.4mm
Thickness: 3mm / 4mm / 5mm / 6mm / 6.35mm
Size can be customized.
Square sputtering target size: 50×50×3mm / 100×100×4mm / 300×300×5mm, size can be customized

Available Metal Forms

Metal Forms Details

We manufacture almost all the metals listed on the periodic table in a wide range of forms and purities, as well as standard sizes and dimensions. We can also produce custom-made products to meet specific customer requirements, such as size, shape, surface area, composition, and more. The following list provides a sample of the forms we offer, but it is not exhaustive. If you need laboratory consumables, please contact us directly to request a quote.

Flat/Planar Forms: Board, Film, Foil, Microfoil, Microleaf, Paper, Plate, Ribbon, Sheet, Strip, Tape, Wafer
Preformed Shapes: Anodes, Balls, Bands, Bars, Boats, Bolts, Briquettes, Cathodes, Circles, Coils, Crucibles, Crystals, Cubes, Cups, Cylinders, Discs, Electrodes, Fibers, Filaments, Flanges, Grids, Lenses, Mandrels, Nuts, Parts, Prisms, Pucks, Rings, Rods, Shapes, Shields, Sleeves, Springs, Squares, Sputtering Targets, Sticks, Tubes, Washers, Windows, Wires
Microsizes: Beads, Bits, Capsules, Chips, Coins, Dust, Flakes, Grains, Granules, Micropowder, Needles, Particles, Pebbles, Pellets, Pins, Pills, Powder, Shavings, Shot, Slugs, Spheres, Tablets
Macrosizes: Billets, Chunks, Cuttings, Fragments, Ingots, Lumps, Nuggets, Pieces, Punchings, Rocks, Scraps, Segments, Turnings
Porous and Semi-Porous: Fabric, Foam, Gauze, Honeycomb, Mesh, Sponge, Wool
Nanoscale: Nanoparticles, Nanopowders, Nanofoils, Nanotubes, Nanorods, Nanoprisms
Others: Concentrate, Ink, Paste, Precipitate, Residue, Samples, Specimens

KinTek specializes in the manufacturing of high-purity and ultra-high-purity materials with a purity range of 99.999% (5N), 99.9999% (6N), 99.99995% (6N5), and in some cases, up to 99.99999% (7N). Our materials are available in specific grades, including UP/UHP, semiconductor, electronic, deposition, fiber optic, and MBE grades. Our high-purity metals, oxides, and compounds are specifically crafted to meet the rigorous demands of high-technology applications and are ideal for use as dopants and precursor materials for thin film deposition, crystal growth of semiconductors, and synthesis of nanomaterials. These materials find use in advanced microelectronics, solar cells, fuel cells, optical materials, and other cutting-edge applications.

Packaging

We use vacuum packaging for our high-purity materials, and each material has specific packaging tailored to its unique characteristics. For instance, our Hf sputter target is externally tagged and labeled to facilitate efficient identification and quality control. We take great care to prevent any damage that could occur during storage or transportation.

FAQ

What is sputtering target?

A sputtering target is a material used in the process of sputter deposition, which involves breaking up the target material into tiny particles that form a spray and coat a substrate, such as a silicon wafer. Sputtering targets are typically metallic elements or alloys, although some ceramic targets are available. They come in a variety of sizes and shapes, with some manufacturers creating segmented targets for larger sputtering equipment. Sputtering targets have a wide range of applications in fields such as microelectronics, thin film solar cells, optoelectronics, and decorative coatings due to their ability to deposit thin films with high precision and uniformity.

How are sputtering targets made?

Sputtering targets are made using a variety of manufacturing processes depending on the properties of the target material and its application. These include vacuum melting and rolling, hot-pressed, special press-sintered process, vacuum hot-pressed, and forged methods. Most sputtering target materials can be fabricated into a wide range of shapes and sizes, with circular or rectangular shapes being the most common. Targets are usually made from metallic elements or alloys, but ceramic targets can also be used. Compound sputtering targets are also available, made from a variety of compounds including oxides, nitrides, borides, sulphides, selenides, tellurides, carbides, crystalline, and composite mixtures.

What is sputtering target used for?

Sputtering targets are used in a process called sputtering to deposit thin films of a material onto a substrate using ions to bombard the target. These targets have a wide range of applications in various fields, including microelectronics, thin film solar cells, optoelectronics, and decorative coatings. They allow for the deposition of thin films of materials onto a variety of substrates with high precision and uniformity, making them an ideal tool for producing precision products. Sputtering targets come in various shapes and sizes and can be specialized to meet the specific requirements of the application.

What are sputtering targets for electronics?

Sputtering targets for electronics are thin discs or sheets of materials such as aluminum, copper, and titanium that are used to deposit thin films onto silicon wafers to create electronic devices like transistors, diodes, and integrated circuits. These targets are used in a process called sputtering, in which atoms of the target material are physically ejected from the surface and deposited onto a substrate by bombarding the target with ions. Sputtering targets for electronics are essential in the production of microelectronics and typically require high precision and uniformity to ensure quality devices.

What is the lifetime of a sputtering target?

The lifetime of a sputtering target depends on factors such as the material composition, purity, and the specific application it is being used for. Generally, targets can last for several hundred to a few thousand hours of sputtering, but this can vary widely depending on the specific conditions of each run. Proper handling and maintenance can also extend the lifetime of a target. In addition, the use of rotary sputtering targets can increase runtimes and reduce the occurrence of defects, making them a more cost-effective option for high volume processes.

View more faqs for this product

4.9

out of

5

KINTEK SOLUTION's Tin Sulfide products are top-notch! Impeccable quality and lightning-fast delivery.

Alice Myers

4.7

out of

5

The Tin Sulfide materials from KINTEK SOLUTION are a game-changer for our lab. Highly recommend!

Robert Smith

4.8

out of

5

KINTEK SOLUTION's Tin Sulfide products are worth every penny. Exceptional quality and outstanding customer service.

Maria Garcia

4.6

out of

5

KINTEK SOLUTION's Tin Sulfide materials never disappoint. Consistent quality and reliable delivery.

David Johnson

4.9

out of

5

KINTEK SOLUTION's Tin Sulfide products are a testament to their commitment to excellence. Highly satisfied!

Isabella Rodriguez

4.7

out of

5

KINTEK SOLUTION's Tin Sulfide materials are a cut above the rest. Impeccable quality and remarkable durability.

William Jones

4.8

out of

5

KINTEK SOLUTION's Tin Sulfide products are an absolute delight to work with. Highly recommend!

Sarah Miller

4.6

out of

5

KINTEK SOLUTION's Tin Sulfide materials are a true asset to our lab. Exceptional quality and reliable performance.

Michael Davis

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