Products Lab Consumables & Materials Lab Materials High Purity Indium Tin Oxide (ITO) Sputtering Target / Powder / Wire / Block / Granule
High Purity Indium Tin Oxide (ITO) Sputtering Target / Powder / Wire / Block / Granule

Lab Materials

High Purity Indium Tin Oxide (ITO) Sputtering Target / Powder / Wire / Block / Granule

Item Number : LM-ITO

Price varies based on specs and customizations


Chemical Formula
ITO
Purity
4N
Shape
discs / wire / block / powder / plates / column targets / step target / custom-made
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We specialize in offering Indium Tin Oxide (ITO) Sputtering Target materials at affordable prices for laboratory use. Our team has expertise in producing and customizing Indium Tin Oxide (ITO) Sputtering Target materials with varying purities, shapes, and sizes to cater to your specific needs.

We provide a diverse range of specifications and sizes for sputtering targets, including circular, square, tubular, and irregular shapes, as well as coating materials, cylinders, cones, particles, foils, powders, 3D printing powders, nanometer powders, wire rods, ingots, and blocks, among others.

Details

Indium Tin Oxide (ITO) Sputtering Target
Indium Tin Oxide (ITO) Sputtering Target
Indium Tin Oxide (ITO) Sputtering Target
Indium Tin Oxide (ITO) Sputtering Target
Indium Tin Oxide (ITO) Sputtering Target
Indium Tin Oxide (ITO) Sputtering Target
Indium Tin Oxide (ITO) Sputtering Target
Indium Tin Oxide (ITO) Sputtering Target
Indium Tin Oxide (ITO) Sputtering Target
Indium Tin Oxide (ITO) Sputtering Target
Indium Tin Oxide (ITO) particles
Indium Tin Oxide (ITO) particles
Indium Tin Oxide (ITO) particles
Indium Tin Oxide (ITO) particles
Indium Tin Oxide (ITO) round block
Indium Tin Oxide (ITO) round block
Indium Tin Oxide (ITO) round block
Indium Tin Oxide (ITO) round block

About Indium Tin Oxide (ITO)

Indium Tin Oxide is a unique transparent semiconductor material that consists of a solid solution of indium(III) oxide (In2O3) and tin(IV) oxide (SnO2).

Indium tin oxide is readily available in most volumes, including high purity, submicron, and nanopowder forms. Our company offers a range of standard grades, such as Mil Spec (military grade), ACS, Reagent and Technical Grade, Food, Agricultural and Pharmaceutical Grade, Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia). We also comply with applicable ASTM testing standards.

We provide both typical and custom packaging options for our products.

Ingredient Quality Control

Raw material composition analysis
Through the use of equipment such as ICP and GDMS, the content of metal impurities is detected and analyzed to ensure that it meets the purity standard;

Non-metallic impurities are detected by equipment such as carbon and sulfur analyzers, nitrogen and oxygen analyzers.
Metallographic flaw detection analysis
The target material is inspected using flaw detection equipment to ensure that there are no defects or shrinkage holes inside the product;

Through metallographic testing, the internal grain structure of the target material is analyzed to ensure that the grains are fine and dense.
Appearance and dimension inspection
Product dimensions are measured using micrometers and precision calipers to ensure compliance with drawings;

The surface finish and cleanliness of the product are measured using a surface cleanliness meter.

Conventional Sputtering Target Sizes

Preparation process
hot isostatic pressing, vacuum melting, etc.
Sputtering target shape
plane sputtering target, multi-arc sputtering target, step sputtering target, special-shaped sputtering target
Round sputtering target size
Diameter: 25.4mm / 50mm / 50.8mm / 60mm / 76.2mm / 80mm / 100mm / 101.6mm / 152.4mm
Thickness: 3mm / 4mm / 5mm / 6mm / 6.35mm
Size can be customized.
Square sputtering target size
50×50×3mm / 100×100×4mm / 300×300×5mm, size can be customized

Available Metal Forms

Metal Forms Details

We manufacture almost all the metals listed on the periodic table in a wide range of forms and purities, as well as standard sizes and dimensions. We can also produce custom-made products to meet specific customer requirements, such as size, shape, surface area, composition, and more. The following list provides a sample of the forms we offer, but it is not exhaustive. If you need laboratory consumables, please contact us directly to request a quote.

  • Flat/Planar Forms: Board, Film, Foil, Microfoil, Microleaf, Paper, Plate, Ribbon, Sheet, Strip, Tape, Wafer
  • Preformed Shapes: Anodes, Balls, Bands, Bars, Boats, Bolts, Briquettes, Cathodes, Circles, Coils, Crucibles, Crystals, Cubes, Cups, Cylinders, Discs, Electrodes, Fibers, Filaments, Flanges, Grids, Lenses, Mandrels, Nuts, Parts, Prisms, Pucks, Rings, Rods, Shapes, Shields, Sleeves, Springs, Squares, Sputtering Targets, Sticks, Tubes, Washers, Windows, Wires
  • Microsizes: Beads, Bits, Capsules, Chips, Coins, Dust, Flakes, Grains, Granules, Micropowder, Needles, Particles, Pebbles, Pellets, Pins, Pills, Powder, Shavings, Shot, Slugs, Spheres, Tablets
  • Macrosizes: Billets, Chunks, Cuttings, Fragments, Ingots, Lumps, Nuggets, Pieces, Punchings, Rocks, Scraps, Segments, Turnings
  • Porous and Semi-Porous: Fabric, Foam, Gauze, Honeycomb, Mesh, Sponge, Wool
  • Nanoscale: Nanoparticles, Nanopowders, Nanofoils, Nanotubes, Nanorods, Nanoprisms
  • Others: Concentrate, Ink, Paste, Precipitate, Residue, Samples, Specimens

KinTek specializes in the manufacturing of high-purity and ultra-high-purity materials with a purity range of 99.999% (5N), 99.9999% (6N), 99.99995% (6N5), and in some cases, up to 99.99999% (7N). Our materials are available in specific grades, including UP/UHP, semiconductor, electronic, deposition, fiber optic, and MBE grades. Our high-purity metals, oxides, and compounds are specifically crafted to meet the rigorous demands of high-technology applications and are ideal for use as dopants and precursor materials for thin film deposition, crystal growth of semiconductors, and synthesis of nanomaterials. These materials find use in advanced microelectronics, solar cells, fuel cells, optical materials, and other cutting-edge applications.

Packaging

We use vacuum packaging for our high-purity materials, and each material has specific packaging tailored to its unique characteristics. For instance, our Hf sputter target is externally tagged and labeled to facilitate efficient identification and quality control. We take great care to prevent any damage that could occur during storage or transportation.

FAQ

What Is Sputtering Target?

A sputtering target is a material used in the process of sputter deposition, which involves breaking up the target material into tiny particles that form a spray and coat a substrate, such as a silicon wafer. Sputtering targets are typically metallic elements or alloys, although some ceramic targets are available. They come in a variety of sizes and shapes, with some manufacturers creating segmented targets for larger sputtering equipment. Sputtering targets have a wide range of applications in fields such as microelectronics, thin film solar cells, optoelectronics, and decorative coatings due to their ability to deposit thin films with high precision and uniformity.

What Are High Purity Metals?

High purity metals are single element materials with minimal impurities, making them ideal for use in research, development, and production of advanced technologies. These metals are used in the creation of advanced ceramics, electronic sensors, high-precision lenses and optics, LEDs, lasers, thermal barrier coatings, plasma screens, and more. KINTEK offers a diverse range of high-purity metals and binary and ternary metal compounds in various forms, compositions, dispersions, particle sizes, and weights for research and commercial applications. Strategic special metals are used in high-tech applications and can be expensive due to their elaborate processing.

How Are Sputtering Targets Made?

Sputtering targets are made using a variety of manufacturing processes depending on the properties of the target material and its application. These include vacuum melting and rolling, hot-pressed, special press-sintered process, vacuum hot-pressed, and forged methods. Most sputtering target materials can be fabricated into a wide range of shapes and sizes, with circular or rectangular shapes being the most common. Targets are usually made from metallic elements or alloys, but ceramic targets can also be used. Compound sputtering targets are also available, made from a variety of compounds including oxides, nitrides, borides, sulphides, selenides, tellurides, carbides, crystalline, and composite mixtures.

What Are High Purity Metals Used For?

High purity metals are used in various advanced technologies that require specific properties, performance and quality. They are used to create fluorescent lighting, plasma screens, LEDs, high-precision lenses and optics, electronic sensors, advanced ceramics, thermal barrier coatings, lasers, and more. These metals are also used in the production of high-quality magnetic, thermoelectric, phosphor and semiconducting materials. KINTEK offers a diverse portfolio of high-purity metals, binary and ternary metal compounds, magnetic alloys, metal oxides, nanomaterials, and organometallic precursors in various forms, compositions, dispersions, particle sizes and weights for all research and commercial applications.

What Is Sputtering Target Used For?

Sputtering targets are used in a process called sputtering to deposit thin films of a material onto a substrate using ions to bombard the target. These targets have a wide range of applications in various fields, including microelectronics, thin film solar cells, optoelectronics, and decorative coatings. They allow for the deposition of thin films of materials onto a variety of substrates with high precision and uniformity, making them an ideal tool for producing precision products. Sputtering targets come in various shapes and sizes and can be specialized to meet the specific requirements of the application.

What Are The Benefits Of Using High-purity Metals?

Using high-purity metals offers several benefits. First, they provide consistent and reliable performance due to the absence of impurities that can cause variations in material properties. Second, high-purity metals enable the production of high-quality and high-performance products, ensuring better functionality and durability. Third, their low impurity levels reduce the risk of contamination in sensitive applications. High-purity metals also exhibit improved electrical conductivity, thermal conductivity, and corrosion resistance. Additionally, they are often preferred for their enhanced adhesion properties, making them suitable for various coating and thin film deposition processes.

What Are Sputtering Targets For Electronics?

Sputtering targets for electronics are thin discs or sheets of materials such as aluminum, copper, and titanium that are used to deposit thin films onto silicon wafers to create electronic devices like transistors, diodes, and integrated circuits. These targets are used in a process called sputtering, in which atoms of the target material are physically ejected from the surface and deposited onto a substrate by bombarding the target with ions. Sputtering targets for electronics are essential in the production of microelectronics and typically require high precision and uniformity to ensure quality devices.

Which Industries Commonly Use High-purity Metals?

High-purity metals find application in a wide range of industries. The semiconductor and electronics industries extensively use high-purity metals for integrated circuits, microprocessors, and other electronic components. The aerospace industry relies on high-purity metals for their lightweight and high-strength properties. Optics and photovoltaic industries utilize high-purity metals for precision optics and solar cells. High-purity metals also play a significant role in medical devices, automotive components, research laboratories, and advanced manufacturing processes.

What Is The Lifetime Of A Sputtering Target?

The lifetime of a sputtering target depends on factors such as the material composition, purity, and the specific application it is being used for. Generally, targets can last for several hundred to a few thousand hours of sputtering, but this can vary widely depending on the specific conditions of each run. Proper handling and maintenance can also extend the lifetime of a target. In addition, the use of rotary sputtering targets can increase runtimes and reduce the occurrence of defects, making them a more cost-effective option for high volume processes.
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4.8

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4.9

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Catalog of High Pure Metals

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