Lab Materials
Tungsten Titanium Alloy (WTi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-WTi
Price varies based on specs and customizations
- Chemical Formula
- WTi
- Purity
- 2N5-4N
- Commonly Used Ratio
- W:Ti=90:10 wt%
- Shape
- discs / wire / block / powder / plates / column targets / step target / custom-made
Shipping:
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At our laboratory, we provide Tungsten Titanium Alloy (WTi) materials at affordable prices. With our specialized knowledge, we excel at producing and customizing Tungsten Titanium Alloy (WTi) materials of varying purities, shapes, and sizes to meet your specific needs.
We offer an extensive selection of specifications and sizes for a range of products including sputtering targets (circular, square, tubular, and irregular), coating materials, cylinders, cones, particles, foils, powders, 3D printing powders, nanometer powders, wire rods, ingots, and blocks.
Details
About Tungsten Titanium Alloy (WTi)
Tungsten Titanium Alloy (WTi) products are available in various forms such as powder, bars, ingots, ribbons, wires, sheets, sputtering targets, foils, and custom shapes. These products are available in both standard and customer-specified element compositions.
Our engineers have specialized knowledge in the field and can provide expert guidance in selecting the most appropriate alloy based on your intended application. With our customized approach, we can tailor the purity, shape, and size of WTi materials to meet your unique requirements.
Ingredient Quality Control
- Raw material composition analysis
- Through the use of equipment such as ICP and GDMS, the content of metal impurities is detected and analyzed to ensure that it meets the purity standard;
Non-metallic impurities are detected by equipment such as carbon and sulfur analyzers, nitrogen and oxygen analyzers. - Metallographic flaw detection analysis
- The target material is inspected using flaw detection equipment to ensure that there are no defects or shrinkage holes inside the product;
Through metallographic testing, the internal grain structure of the target material is analyzed to ensure that the grains are fine and dense. - Appearance and dimension inspection
- Product dimensions are measured using micrometers and precision calipers to ensure compliance with drawings;
The surface finish and cleanliness of the product are measured using a surface cleanliness meter.
Conventional Sputtering Target Sizes
- Preparation process
- hot isostatic pressing, vacuum melting, etc.
- Sputtering target shape
- plane sputtering target, multi-arc sputtering target, step sputtering target, special-shaped sputtering target
- Round sputtering target size
- Diameter: 25.4mm / 50mm / 50.8mm / 60mm / 76.2mm / 80mm / 100mm / 101.6mm / 152.4mm
Thickness: 3mm / 4mm / 5mm / 6mm / 6.35mm
Size can be customized. - Square sputtering target size
- 50×50×3mm / 100×100×4mm / 300×300×5mm, size can be customized
Available Metal Forms
Metal Forms Details
We manufacture almost all the metals listed on the periodic table in a wide range of forms and purities, as well as standard sizes and dimensions. We can also produce custom-made products to meet specific customer requirements, such as size, shape, surface area, composition, and more. The following list provides a sample of the forms we offer, but it is not exhaustive. If you need laboratory consumables, please contact us directly to request a quote.
- Flat/Planar Forms: Board, Film, Foil, Microfoil, Microleaf, Paper, Plate, Ribbon, Sheet, Strip, Tape, Wafer
- Preformed Shapes: Anodes, Balls, Bands, Bars, Boats, Bolts, Briquettes, Cathodes, Circles, Coils, Crucibles, Crystals, Cubes, Cups, Cylinders, Discs, Electrodes, Fibers, Filaments, Flanges, Grids, Lenses, Mandrels, Nuts, Parts, Prisms, Pucks, Rings, Rods, Shapes, Shields, Sleeves, Springs, Squares, Sputtering Targets, Sticks, Tubes, Washers, Windows, Wires
- Microsizes: Beads, Bits, Capsules, Chips, Coins, Dust, Flakes, Grains, Granules, Micropowder, Needles, Particles, Pebbles, Pellets, Pins, Pills, Powder, Shavings, Shot, Slugs, Spheres, Tablets
- Macrosizes: Billets, Chunks, Cuttings, Fragments, Ingots, Lumps, Nuggets, Pieces, Punchings, Rocks, Scraps, Segments, Turnings
- Porous and Semi-Porous: Fabric, Foam, Gauze, Honeycomb, Mesh, Sponge, Wool
- Nanoscale: Nanoparticles, Nanopowders, Nanofoils, Nanotubes, Nanorods, Nanoprisms
- Others: Concentrate, Ink, Paste, Precipitate, Residue, Samples, Specimens
KinTek specializes in the manufacturing of high-purity and ultra-high-purity materials with a purity range of 99.999% (5N), 99.9999% (6N), 99.99995% (6N5), and in some cases, up to 99.99999% (7N). Our materials are available in specific grades, including UP/UHP, semiconductor, electronic, deposition, fiber optic, and MBE grades. Our high-purity metals, oxides, and compounds are specifically crafted to meet the rigorous demands of high-technology applications and are ideal for use as dopants and precursor materials for thin film deposition, crystal growth of semiconductors, and synthesis of nanomaterials. These materials find use in advanced microelectronics, solar cells, fuel cells, optical materials, and other cutting-edge applications.
Packaging
We use vacuum packaging for our high-purity materials, and each material has specific packaging tailored to its unique characteristics. For instance, our Hf sputter target is externally tagged and labeled to facilitate efficient identification and quality control. We take great care to prevent any damage that could occur during storage or transportation.
FAQ
What is Physical vapor deposition (PVD)?
What is sputtering target?
What are high purity materials?
What is magnetron sputtering?
How are sputtering targets made?
Why magnetron sputtering?
What is sputtering target used for?
What are the materials used in thin film deposition?
Thin film deposition commonly utilizes metals, oxides, and compounds as materials, each with its unique advantages and disadvantages. Metals are preferred for their durability and ease of deposition but are relatively expensive. Oxides are highly durable, can withstand high temperatures, and can be deposited at low temperatures, but can be brittle and challenging to work with. Compounds offer strength and durability, can be deposited at low temperatures and tailored to exhibit specific properties.
The selection of material for a thin film coating is dependent on the application requirements. Metals are ideal for thermal and electrical conduction, while oxides are effective in offering protection. Compounds can be tailored to suit specific needs. Ultimately, the best material for a particular project will depend on the specific needs of the application.
What are sputtering targets for electronics?
What are the methods to achieve optimal thin film deposition?
To achieve thin films with desirable properties, high-quality sputtering targets and evaporation materials are essential. The quality of these materials can be influenced by various factors, such as purity, grain size, and surface condition.
The purity of sputtering targets or evaporation materials plays a crucial role, as impurities can cause defects in the resulting thin film. Grain size also affects the quality of the thin film, with larger grains leading to poor film properties. Additionally, the surface condition is crucial, since rough surfaces can result in defects in the film.
To attain the highest quality sputtering targets and evaporation materials, it is crucial to select materials that possess high purity, small grain size, and smooth surfaces.
Uses of Thin Film Deposition
Zinc Oxide-Based Thin Films
ZnO thin films find applications in several industries such as thermal, optical, magnetic, and electrical, but their primary use is in coatings and semiconductor devices.
Thin-Film Resistors
Thin-film resistors are crucial for modern technology and are used in radio receivers, circuit boards, computers, radiofrequency devices, monitors, wireless routers, Bluetooth modules, and cell phone receivers.
Magnetic Thin Films
Magnetic thin films are used in electronics, data storage, radio-frequency identification, microwave devices, displays, circuit boards, and optoelectronics as key components.
Optical Thin Films
Optical coatings and optoelectronics are standard applications of optical thin films. Molecular beam epitaxy can produce optoelectronic thin-film devices (semiconductors), where epitaxial films are deposited one atom at a time onto the substrate.
Polymer Thin Films
Polymer thin films are used in memory chips, solar cells, and electronic devices. Chemical deposition techniques (CVD) offer precise control of polymer film coatings, including conformance and coating thickness.
Thin-Film Batteries
Thin-film batteries power electronic devices such as implantable medical devices, and the lithium-ion battery has advanced significantly thanks to the use of thin films.
Thin-Film Coatings
Thin-film coatings enhance the chemical and mechanical characteristics of target materials in various industries and technological fields. Anti-reflective coatings, anti-ultraviolet or anti-infrared coatings, anti-scratch coatings, and lens polarization are some common examples.
Thin-Film Solar Cells
Thin-film solar cells are essential to the solar energy industry, enabling the production of relatively cheap and clean electricity. Photovoltaic systems and thermal energy are the two main applicable technologies.
What is the lifetime of a sputtering target?
Factors and Parameters that Influence Deposition of Thin Films
Deposition Rate:
The rate at which the film is produced, typically measured in thickness divided by time, is crucial for selecting a technology suitable for the application. Moderate deposition rates are sufficient for thin films, while quick deposition rates are necessary for thick films. It is important to strike a balance between speed and precise film thickness control.
Uniformity:
The consistency of the film across the substrate is known as uniformity, which usually refers to film thickness but can also relate to other properties such as the index of refraction. It is important to have a good understanding of the application to avoid under- or over-specifying uniformity.
Fill Capability:
Fill capability or step coverage refers to how well the deposition process covers the substrate's topography. The deposition method used (e.g., CVD, PVD, IBD, or ALD) has a significant impact on step coverage and fill.
Film Characteristics:
The characteristics of the film depend on the application's requirements, which can be categorized as photonic, optical, electronic, mechanical, or chemical. Most films must meet requirements in more than one category.
Process Temperature:
Film characteristics are significantly affected by process temperature, which may be limited by the application.
Damage:
Each deposition technology has the potential to damage the material being deposited upon, with smaller features being more susceptible to process damage. Pollution, UV radiation, and ion bombardment are among the potential sources of damage. It is crucial to understand the limitations of the materials and tools.
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It has a high melting point, thermal and electrical conductivity, and corrosion resistance. It is a valuable material for high temperature, vacuum and other industries.
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