Increasing the sputtering rate is crucial for enhancing the efficiency of your deposition process.
To achieve this, you need to focus on several key areas: enhancing the ionization of the plasma, optimizing sputtering parameters, and adjusting key variables such as target power density, gas pressure, substrate temperature, and deposition rate.
5 Key Strategies to Increase Your Sputtering Rate
1. Increasing the Target's Sputtering Rate
At the same discharge power, more ions are needed to increase the sputtering rate.
This can be achieved by increasing the ionization degree of the plasma.
Improved plasma ionization can be effectively achieved by fully utilizing the energy of secondary electrons.
The more ions produced, the more atoms ejected from the target, which increases the efficiency of the sputtering process.
2. Improving Plasma Ionization
Utilizing secondary electrons' energy is crucial for improving plasma ionization.
In magnetron sputtering, an additional magnetic field under the target can help electrons fly in long spiral tracks, increasing the probability of ionization.
This not only leads to higher sputter rates but also better focus on the target.
3. Adjusting Key Parameters
The key magnetron sputtering parameters include target power density, gas pressure, substrate temperature, and deposition rate.
Optimizing the target power density can help achieve the desired sputtering rate and film quality.
However, a higher target power density can increase the sputtering rate but may lead to lower film quality.
Similarly, optimizing gas pressure, substrate temperature, and deposition rate can help realize desired film quality, properties, and uniformity.
4. Using Appropriate Power Types
Depending on the material being sputtered, different types of power can be used.
DC power is suitable for conductive materials, while RF power can sputter non-conductive materials.
Pulsed DC has advantages for some processes such as reactive sputtering.
5. Reactive Sputtering for Oxides
If oxides need to be deposited on the substrate, reactive sputtering is applied.
In addition to the sputter gas Argon, Oxygen is introduced into the vacuum chamber.
Oxygen reacts with the target material into oxides, enhancing the deposition process for specific materials.
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