The two major methods of deposition are physical vapor deposition (PVD) and chemical vapor deposition (CVD).
1. Physical Vapor Deposition (PVD): In PVD, a vapor is created by heating or sputtering a solid material and the vapor condenses onto a substrate to form a thin film. The vapor is made up of atoms and molecules that simply condense on the substrate without undergoing any chemical reaction. PVD methods include evaporation and spraying.
2. Chemical Vapor Deposition (CVD): In CVD, a vapor undergoes a chemical reaction on the substrate surface to form a thin film. The reaction is typically initiated by reacting a precursor fluid with the substrate. CVD methods include chemical bath deposition, electroplating, molecular beam epitaxy, thermal oxidation, and plasma-enhanced CVD (PECVD).
Both PVD and CVD are used to create thin films of different materials on various substrates. The choice between the two methods depends on factors such as cost, film thickness, source material availability, and compositional control. PVD is suitable for situations where a simple condensation of atoms or molecules is sufficient, while CVD is preferred when a chemical reaction is required to form the desired thin film.
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