The main difference between thermal evaporation and e-beam evaporation is the method used to vaporize the material.
In thermal evaporation, a material is vaporized using heat. A crucible containing the material is heated to a high temperature, causing the material to vaporize. This method is well suited for metals and non-metal materials that require a lower melting temperature. Thermal evaporation can produce thin films with good purity and adhesion to the substrate but may result in less dense coatings and a greater risk of impurities due to the crucible being heated.
On the other hand, e-beam evaporation is a physical vapor deposition process that uses a beam of high-energy electrons to vaporize the material. The vaporized material then condenses onto a substrate to form a thin film. E-beam evaporation can handle higher temperature materials, such as oxides, and can produce films with high purity and good adhesion to the substrate. It also has a higher deposition rate compared to thermal evaporation.
In summary, thermal evaporation uses heat to vaporize the material while e-beam evaporation uses a beam of high-energy electrons. The choice between the two methods depends on the specific requirements of the material being deposited and the desired properties of the thin film.
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