Knowledge What is the Formula for Deposition Rate of Thin Film? 5 Key Factors to Consider
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Tech Team · Kintek Solution

Updated 2 months ago

What is the Formula for Deposition Rate of Thin Film? 5 Key Factors to Consider

The formula for the deposition rate of a thin film is given by C = T/t.

In this formula:

  • C is the deposition rate.
  • T is the thickness of the film.
  • t is the deposition time.

The deposition rate measures how fast the film grows.

It is typically expressed in units like:

  • A/s (angstroms per second)
  • nm/min (nanometers per minute)
  • um/hour (micrometers per hour)

5 Key Factors to Consider When Using Deposition Equipment

What is the Formula for Deposition Rate of Thin Film? 5 Key Factors to Consider

1. Application of the Thin Film

The choice of deposition rate depends on the application of the thin film.

For thin films, a relatively slow deposition rate is preferred to maintain control and precise control of the film thickness.

For thick films, a fast deposition rate may be desired.

2. Tradeoffs Between Film Properties and Process Conditions

Faster rate processes often require higher power, temperatures, or gas flows.

These can affect or limit other film characteristics such as uniformity, stress, or density.

3. Variation in Deposition Rates

Deposition rates can vary widely, ranging from a few tens of A/min (angstroms per minute) up to 10,000 A/min.

Techniques like quartz crystal monitoring and optical interference can be used to monitor the film thickness growth in real time.

4. Magnetron Sputtering Calculation

In magnetron sputtering, the deposition rate can be calculated using the formula Rdep = A x Rsputter.

Here:

  • Rdep is the deposition rate.
  • A is the deposition area.
  • Rsputter is the sputtering rate.

Magnetron sputtering parameters and optimization techniques can be adjusted to achieve the desired film quality and properties.

5. Uniformity in Deposition

Uniformity refers to the consistency of the film across a substrate, usually in terms of film thickness.

It can also refer to other film properties such as the index of refraction.

Deposition uniformity is typically measured by averaging the collected data across a wafer, with a standard deviation representing the deviation from the average.

The deposition area and sputtering rate can also affect the uniformity of the deposited thin film.

Continue Exploring, Consult Our Experts

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