Physical Vapor Deposition (PVD) is a technique used to deposit thin films by converting a solid material into a vapor state through physical means, transporting this vapor across a low-pressure region, and condensing it onto a substrate to form a thin film. This process is typically performed under vacuum conditions and involves several steps including gasification of the source material, transportation of the vapor, and condensation on the substrate. PVD is widely used in various industries due to its ability to produce hard, corrosion-resistant coatings with high temperature tolerance and strong adhesion to the substrate. The most common PVD methods include sputtering and evaporation, which differ from Chemical Vapor Deposition (CVD) in that PVD involves physical rather than chemical processes to deposit the material. PVD is also considered environmentally friendly as it does not involve hazardous chemicals.
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