The rate of electron beam evaporation can vary depending on several factors. According to the references provided, the deposition rate of electron beam evaporation can range from 0.1 μm/min to 100 μm/min. This is considered a high deposition rate compared to other physical vapor deposition (PVD) techniques.
The electron beam evaporation process involves generating an intense electron beam from a filament and directing it towards the source material within a vacuum environment. The energy from the electron beam is transferred to the source material, causing its surface atoms to have sufficient energy to leave the surface and traverse the vacuum chamber. These atoms then coat a substrate positioned above the evaporating material.
The average working distances for electron beam evaporation are typically between 300 mm to 1 meter. The technique has been developed over time to improve efficiency and avoid issues such as shorting due to the deposition of evaporated material on filament insulators.
Electron beam evaporation is particularly suitable for materials with high melting points, such as metals like tungsten and tantalum. The electron beam can heat the source material to temperatures around 3000 °C, causing it to evaporate or sublimate. The process is highly localized, occurring at the point of beam bombardment on the source surface, which minimizes contamination from the crucible.
Adding a partial pressure of reactive gas, such as oxygen or nitrogen, during the evaporation process allows for the reactive deposition of non-metallic films. This means that electron beam evaporation can also be used to coat substrates with materials that react with the introduced gas.
Overall, electron beam evaporation is a time-tested deposition technology that offers high deposition rates, high material utilization efficiency, and the ability to deposit dense and high-purity coatings.
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