The rate of physical vapor deposition (PVD) is not explicitly stated in the provided references, but it can be inferred from the description of the process and the typical thickness of the coatings produced. PVD is a process that involves the deposition of thin films with a thickness usually in the range of 1 to 10µm (micrometers). The rate of deposition would depend on the specific PVD technique used, the material being deposited, the equipment, and the conditions within the deposition chamber (such as temperature, pressure, and the presence of reactive gases).
To determine the rate of PVD, one would typically consider the time it takes to achieve the desired film thickness. For example, if a PVD process is depositing a film at a rate of 1µm per hour, and the desired thickness is 5µm, then the process would take approximately 5 hours to complete. However, without specific data on deposition rates for a given PVD technique and material, a precise rate cannot be provided.
In summary, the rate of PVD is a variable that depends on several factors and is typically measured in terms of the thickness of the film deposited per unit of time. The actual rate would need to be determined experimentally or provided by the manufacturer of the PVD equipment for a specific application.
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