The sputtering voltage of a magnetron is typically around -300 V. This voltage is applied to the target in a magnetron sputtering system, which is a type of physical vapor deposition technique used for depositing thin films from a solid target material onto a substrate.
Explanation of the Sputtering Voltage:
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Voltage Application: When power is supplied to the magnetron, a negative voltage, typically around -300 V, is applied to the target. This voltage is negative relative to the surrounding plasma environment, which is maintained at a higher, positive potential.
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Ion Attraction: The negative voltage on the target attracts positive ions from the plasma. These ions are typically argon ions in a sputtering system, which are generated by ionization of argon gas within the vacuum chamber.
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Energy Transfer and Sputtering: When these positive ions collide with the target surface, they transfer energy. If the energy transferred is greater than about three times the surface binding energy of the target material (approximately equal to the heat of sublimation), atoms from the target surface are ejected, a process known as sputtering.
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Plasma Stability and Efficiency: The electrons in the plasma travel a longer distance due to the magnetic field, increasing the probability of ionizing more argon atoms and maintaining a stable plasma with high ion density. This efficient ionization allows the sputtering process to operate at lower pressures (around 100 Pa) and lower voltages (around -500 V) compared to conventional sputtering, which might require higher voltages (between -2 kV to 3 kV) and lower pressures (around 10 Pa).
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Advantages of Low Voltage Operation: Operating at lower voltages (below 1000 V) and high currents in magnetron sputtering is more efficient than DC diode sputtering. This efficiency is due to the magnetic field's role in confining electrons near the target, enhancing ionization and thus the deposition rate. Lower voltages also make arcs less violent and easier to handle, which is crucial for maintaining the integrity of the deposition process and the quality of the deposited films.
In summary, the sputtering voltage in a magnetron setup is crucial for initiating and maintaining the sputtering process, with typical values around -300 V. This voltage setup facilitates the efficient ejection of target material atoms, leading to the deposition of thin films with controlled properties.
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