Thermal evaporation is a method of physical vapor deposition (PVD) that involves the use of a resistive heat source to evaporate a solid material in a vacuum environment, resulting in the formation of a thin film on a substrate.
This technique is characterized by its simplicity and low power consumption, making it a popular choice for various applications.
1. Heating Mechanism
The thermal evaporation process begins with the heating of the material to be deposited.
This is typically achieved using a resistive heat source, which can be a "boat", "basket", or "coil" made of materials that can withstand high temperatures.
The heating is done by passing a high electric current through this device, which in turn heats the material to its melting point and then to its vaporization point.
2. Vacuum Environment
The process is carried out in a high vacuum chamber, with pressures often less than 10^-5 torr.
This vacuum environment is crucial as it prevents contamination of the coating and allows the vaporized material to travel unimpeded to the substrate.
The vacuum also ensures that the material evaporates cleanly, without reacting with other gases present in the chamber.
3. Deposition of Thin Film
Once the material is evaporated, it forms a vapor stream that travels across the vacuum chamber.
This vapor stream then condenses on the substrate, forming a thin film.
The energy of the evaporated particles is relatively low, approximately 0.12 eV, which is a characteristic feature of thermal evaporation compared to other PVD methods like arc deposition.
4. Materials Used
Thermal evaporation can be used to deposit a variety of materials, including pure atomic elements (metals and non-metals) and certain molecules such as oxides and nitrides.
The choice of material depends on the application and the properties desired in the thin film.
5. Applications and Advantages
This technique is widely used due to its simplicity and low power requirements.
It is suitable for applications where a clean, uniform coating is required.
The low energy of the evaporated particles also means that the substrate experiences minimal thermal stress, which is beneficial for temperature-sensitive materials.
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