To evaporate metal, there are two commonly used methods: electron-beam evaporation and thermal evaporation.
1. Electron-beam evaporation: This method uses a focused electron beam to heat and evaporate metals. The temperature of the electrons is typically around 3000 °C, and a high voltage DC source accelerates them towards the target material. The electron beam is directed at a specific point on the surface of the metal, causing rapid heating and vaporization. This process is particularly useful for metals with high melting points, such as tungsten and tantalum. Electron-beam evaporation results in minimal contamination from the crucible.
2. Thermal evaporation: In this method, a metal evaporator is used to evaporate various metals onto a substrate or film. The metal evaporator typically consists of a crucible and a heat source. The metal is placed in the crucible, which is then heated to high temperatures. As the metal reaches its melting point, it turns into a liquid and eventually evaporates into a vapor. This vapor condenses onto surfaces within the chamber, coating them with a thin layer of the metal. Thermal evaporation can be performed using a mask to selectively coat specific patterns onto a sample. Different metals such as aluminum, gold, chromium, germanium, nickel, silicon oxide, and titanium can be used for evaporation.
Both methods require a high vacuum environment to minimize gas collisions and unwanted reactions during the deposition process. The metal evaporator should be operated under controlled conditions, and proper safety protocols must be followed. It is crucial to receive permission and training from a qualified individual, such as Dr. Knobel in the Physics department, before using the metal evaporator.
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