Deposition can be classified as either physical or chemical.
Physical deposition, also known as physical vapor deposition (PVD), involves the use of mechanical, electromechanical, or thermodynamic means to produce a thin film of solid. Examples of physical deposition include evaporation, sublimation, and sputtering. In physical deposition, no new substances are produced during the manufacturing process. It typically requires a low-pressure vapor environment to function properly and is often carried out in high vacuum or UHV to avoid contamination from the ambient atmosphere. Physical deposition methods are favored for their ability to provide controlled and reproducible film properties, such as composition, thickness, microstructure, and adhesion.
On the other hand, chemical deposition, also known as chemical vapor deposition (CVD), involves chemical reactions from the vapor phase. This includes processes like chemical bath deposition, electroplating, molecular beam epitaxy, and thermal oxidation. Chemical deposition methods involve the consumption of old materials and the production of new substances. It may utilize an inert carrier gas and can even be carried out at atmospheric pressure. Chemical deposition allows for the deposition of thin films with desired properties, such as chemical, mechanical, electrical, or optical properties.
Both physical and chemical deposition methods have their applications and advantages. The choice between the two methods depends on various factors such as cost, film thickness, source material availability, and compositional control. Physical vapor deposition is often preferred in "environmentally-friendly" society due to its minimal pollution.
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