Magnetron sputtering is a type of Physical Vapor Deposition (PVD). This method involves the use of electrical generation of plasma between the target material and the substrate. The high-energy ions within the plasma collide with the surface of the target material, causing particles of the material to be sputtered out and deposited on a substrate to form a film. The term "magnetron sputtering" comes from the addition of magnetic fields to control the speed and behavior of the charged particles (ions).
PVD methods, including magnetron sputtering, involve the vaporization and depositing of solid material on a substrate. This is in contrast to Chemical Vapor Deposition (CVD), which relies on a reaction between precursors in the deposition chamber. The advantage of PVD, and specifically magnetron sputtering, is the ability to create highly precise and uniform thin films with high speed, low temperature, and low damage. This makes it a popular choice for manufacturing semiconductors, disk drives, CDs, and optical devices.
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