Magnetron sputtering is a type of Physical Vapor Deposition (PVD).
This method involves the use of electrical generation of plasma between the target material and the substrate.
The high-energy ions within the plasma collide with the surface of the target material, causing particles of the material to be sputtered out and deposited on a substrate to form a film.
The term "magnetron sputtering" comes from the addition of magnetic fields to control the speed and behavior of the charged particles (ions).
5 Key Points to Understand
1. Magnetron Sputtering is a PVD Method
Magnetron sputtering is classified under Physical Vapor Deposition (PVD).
2. Plasma Generation and Interaction
It uses electrical generation of plasma between the target material and the substrate.
High-energy ions in the plasma collide with the target material, causing particles to be sputtered out.
3. Magnetic Fields for Control
The term "magnetron sputtering" originates from the use of magnetic fields to control the speed and behavior of charged particles.
4. Contrast with CVD
PVD methods, including magnetron sputtering, involve the vaporization and depositing of solid material on a substrate.
This is different from Chemical Vapor Deposition (CVD), which relies on a reaction between precursors in the deposition chamber.
5. Advantages of Magnetron Sputtering
Magnetron sputtering allows for the creation of highly precise and uniform thin films with high speed, low temperature, and low damage.
This makes it a popular choice for manufacturing semiconductors, disk drives, CDs, and optical devices.
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