When it comes to achieving better step coverage, particularly on uneven surfaces, sputtering is generally considered superior to evaporation.
5 Key Reasons Why Sputtering is Better for Step Coverage
1. Higher Energy of Deposited Species
In sputtering, the energy of the deposited species ranges from 1–100 eV. This is significantly higher than in evaporation, where it is typically 0.1–0.5 eV. The higher energy allows the atoms to better conform to the substrate's topography, leading to improved step coverage on uneven surfaces.
2. Uniformity and Grain Size
Sputtering produces more homogeneous films with smaller grain sizes compared to evaporation. This homogeneity is crucial for achieving uniform coverage over complex geometries, ensuring that the film is evenly distributed across the surface, including over steps and edges.
3. Stronger Adhesion
Sputtering results in higher adhesion of the film to the substrate. This strong adhesion is beneficial for maintaining the integrity of the film, especially on surfaces with high aspect ratios or complex shapes, where weak adhesion could lead to peeling or delamination.
4. Higher Absorption Rates
Sputtering processes tend to have higher absorption rates. This can be advantageous in ensuring that the deposited material fully integrates into the substrate, further enhancing step coverage and film quality.
5. Complexity and Speed
While sputtering is more complex and slower than evaporation, these characteristics are often offset by the superior quality and uniformity of the deposited films. The slower deposition rate in sputtering can actually be beneficial for achieving better step coverage, as it allows for more precise control over the film's thickness and uniformity.
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