Physical vapor deposition (PVD) involves several types of processes that transform materials from a condensed phase to a vapor phase and then back to a condensed thin film on a substrate. The main types of PVD processes include sputtering and evaporation, each with their own sub-techniques and applications.
Sputtering is a process where atoms from a solid target material are ejected by energetic粒子轰击 into a gaseous phase and then deposited onto a substrate. This technique includes several sub-types:
- Magnetron Sputtering: Uses a magnetic field to trap electrons near the target surface, increasing the ionization of the sputtering gas and enhancing the sputtering rate.
- Ion Beam Sputtering: Involves directing a focused ion beam onto the target to eject material.
- Reactive Sputtering: Combines sputtering with a reactive gas to form compound films, such as oxides or nitrides.
- Ion Assisted Sputtering: Adds an ion beam to the process to improve film properties.
- Gas Flow Sputtering: Controls the flow of gas to optimize the deposition process.
Evaporation involves heating a source material to cause it to evaporate and then condense on a cooler substrate, forming a thin film. This process can be further categorized into:
- Thermal Evaporation: Directly heats the material using resistive or inductive heating.
- E-beam (Electron Beam) Evaporation: Uses an electron beam to heat the material, allowing for higher melting materials to be evaporated.
These PVD techniques are used to deposit a variety of materials including metals, alloys, and ceramics, with applications ranging from mechanical and optical to chemical and electronic functions. The choice of technique depends on the specific requirements of the thin film, such as adhesion, density, and purity.
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