Thermal evaporation is a method used in physical vapor deposition (PVD) to deposit thin films. However, it comes with several disadvantages that can affect the quality and performance of the deposited films.
What are the 3 Major Disadvantages of Thermal Evaporation?
1. High Impurity Levels
Thermal evaporation often results in high impurity levels compared to other PVD methods. This is because the material is heated and evaporated in a vacuum. Impurities can come from the source material or the evaporation process itself, especially if the vacuum environment is not optimal. These impurities can degrade the performance of the films, especially in applications requiring high purity, such as electronics and optics.
2. Moderate Film Stress
Films deposited through thermal evaporation often have moderate levels of stress. This stress can be intrinsic to the material or induced during the deposition process. Film stress can cause issues like delamination, cracking, or deformation of the substrate, particularly in thin film applications. Managing and reducing film stress is essential for maintaining the integrity and functionality of the deposited layers.
3. Film Density and Uniformity
The quality of films deposited via thermal evaporation can be compromised without specific enhancements like ion-assist sources or uniformity masks. Without these, the films may have low density and poor uniformity. Low-density films can be porous and less durable, affecting their electrical and mechanical properties. Uniformity issues can lead to variations in film thickness and properties across the substrate, which is undesirable in many applications, especially where precise and consistent film properties are required.
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