Techniques of vapor phase include:
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Photo-initiated CVD (PICVD) - This process utilizes UV light to initiate chemical reactions, similar to plasma processing due to the strong UV radiation emitted by plasmas. PICVD can operate at or near atmospheric pressure under specific conditions. This technique is particularly useful for applications where plasma-induced damage is a concern, as it can provide a gentler alternative while still achieving the desired chemical reactions.
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Laser chemical vapor deposition (LCVD) - LCVD employs lasers to heat specific spots or lines on a substrate, primarily in semiconductor applications. In MEMS and fiber production, lasers are used to rapidly break down precursor gases, with process temperatures potentially exceeding 2000 °C. This method allows for the precise deposition of materials in specific patterns or structures, similar to how laser sintering 3-D printers build up solids from powders.
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Physical Vapor Deposition (PVD) - PVD involves the vaporization of a solid material using high-energy sources like electron beams or plasmas, or through simple heating. The vaporized material then condenses onto a substrate to form a thin film. PVD is versatile, capable of depositing a wide range of materials including metals, alloys, and ceramics. It is commonly used in coating and surface treatment applications, as well as in semiconductor fabrication.
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Chemical Vapor Deposition (CVD) - CVD involves the use of gaseous species that are dissociated to produce vapors. These vapors then react and deposit on a substrate to form a thin film. CVD techniques include thermal CVD and plasma-enhanced CVD (PECVD), each suited for different applications depending on the required film properties and deposition conditions.
Each of these techniques offers unique advantages and is selected based on the specific requirements of the application, such as the type of material to be deposited, the desired film properties, and the operating conditions.
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