Summary: Two advantages of using sputtering as opposed to evaporation to create a metal interconnect system are better film quality and uniformity, and easier control over film thickness and composition.
Detailed Explanation:
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Better Film Quality and Uniformity: Sputtering is known for producing films with superior quality and uniformity compared to evaporation. This is because sputtering involves the bombardment of a target material with energetic particles, which leads to a more uniform deposition of the material onto the substrate. The resulting film is more consistent across its surface, which can lead to higher yield in manufacturing processes. This uniformity is crucial in metal interconnect systems where consistent electrical properties are essential.
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Easier Control Over Film Thickness and Composition: Sputtering allows for more precise control over the thickness of the deposited film by adjusting the deposition time and operating parameters. Additionally, controlling the alloy composition and other film properties such as step coverage and grain structure is more straightforward with sputtering than with evaporation. This control is vital for creating metal interconnect systems that require specific material properties to function effectively. Sputtering also enables the deposition of materials with very high melting points, which are difficult or impossible to evaporate, thus expanding the range of materials that can be used in interconnect systems.
These advantages make sputtering a preferred method for creating metal interconnect systems where precision, uniformity, and control over material properties are critical.
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