When it comes to creating metal interconnect systems, sputtering offers several advantages over evaporation.
Two Advantages of Using Sputtering Over Evaporation
1. Better Film Quality and Uniformity
Sputtering is known for producing films with superior quality and uniformity compared to evaporation.
This is because sputtering involves the bombardment of a target material with energetic particles.
This leads to a more uniform deposition of the material onto the substrate.
The resulting film is more consistent across its surface.
This uniformity is crucial in metal interconnect systems where consistent electrical properties are essential.
2. Easier Control Over Film Thickness and Composition
Sputtering allows for more precise control over the thickness of the deposited film.
This can be achieved by adjusting the deposition time and operating parameters.
Controlling the alloy composition and other film properties such as step coverage and grain structure is more straightforward with sputtering than with evaporation.
This control is vital for creating metal interconnect systems that require specific material properties to function effectively.
Sputtering also enables the deposition of materials with very high melting points.
These materials are difficult or impossible to evaporate.
This expands the range of materials that can be used in interconnect systems.
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