During vapour deposition, materials are transformed from their gaseous state into a solid film on a substrate.
This process is achieved through various methods such as arc vapour deposition, chemical vapour deposition (CVD), and physical vapour deposition (PVD).
Each method involves specific processes that lead to the formation of thin films.
These thin films are used for various applications including surface coatings and microelectronic device fabrication.
Arc Vapour Deposition
In arc vapour deposition, an electric arc is used to vaporize a material.
This typically happens from a cathodic or anodic electrode, and the material is deposited onto a substrate.
The substrate is often electrically biased to accelerate the film ions towards its surface.
The vaporized material is highly ionized, which distinguishes this method from simple vacuum or thermal evaporation.
The ionization enhances the formation of thicker coatings, making this method suitable for hard and decorative surface coatings.
The process involves generating a flux by moving an arc across the target surface.
This ejects atoms that condense on the substrate to form a thin film.
Chemical Vapour Deposition (CVD)
CVD involves the use of gaseous or vaporized precursors that react at the gas-solid interface to form solid deposits.
The process includes several steps: transport of reacting gaseous species to the substrate surface, adsorption of these species, heterogeneous surface-catalyzed reactions, surface diffusion to growth sites, nucleation and growth of the film, and desorption of gaseous reaction products.
CVD is versatile, capable of depositing a wide range of materials including metals, ceramics, and composites.
It operates under heat and low atmospheric pressure, ensuring uniform coating even on complex-shaped surfaces.
Physical Vapour Deposition (PVD)
PVD involves the vaporization of a solid or liquid source material in a vacuum.
This is followed by the condensation of the vapor onto a surface to form a thin film.
The process occurs in a vacuum chamber to minimize collisions with gas molecules, ensuring the deposition of pure and dense films.
PVD methods include sputtering, thermal evaporation, e-beam evaporation, and laser ablation.
Each method contributes to the formation of coatings that are only a few atoms thick, with high purity and good adhesion to the substrate.
Summary
In summary, vapour deposition techniques are crucial for the formation of thin films in various industrial applications.
Each method has its unique mechanisms and advantages, tailored to specific needs such as coating thickness, material type, and substrate complexity.
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