Physical vapor deposition (PVD) is a method used to deposit a thin layer of material onto a substrate surface in a vacuum environment.
PVD is a vaporization coating technique where the material to be deposited starts in solid form.
PVD processes are carried out under vacuum conditions and involve four main steps: evaporation, transportation, reaction, and deposition.
5 Key Steps Explained
1. Evaporation
In the evaporation step, a target is bombarded by a high-energy source such as a beam of electrons or ions.
This dislodges atoms from the surface of the target, vaporizing them and depositing the material on the workpiece.
2. Transportation
During the transportation step, the vaporized atoms move from the target to the substrate or the piece to be coated.
3. Reaction
The reaction step involves the atoms of the deposition material reacting with the gas during the transport stage.
4. Deposition
Finally, in the deposition step, the atoms that were vaporized and transported react with the substrate surface, forming a thin film or coating.
5. Application
PVD can be used to deposit thin films of various materials, often metals, onto surfaces to give them a hard and durable coating.
It is an alternative process to electroplating and can be used in applications such as architectural ironmongery and medical devices.
PVD offers several advantages in the medical field as it allows atoms to coat devices in a proper manner.
Since the devices are used near or inside the body, using the physical vapor deposition method ensures a proper deposition of the coating material.
Overall, PVD is a versatile and widely used technique for depositing thin films or coatings on various surfaces, providing enhanced durability and other desirable properties.
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