Vapor deposition in thin films is a process used to deposit thin layers of material onto a substrate.
This process typically happens under controlled conditions in a vacuum environment.
It is crucial in the fabrication of micro/nano devices.
The process involves the emission of particles from a source, their transportation to the substrate, and their condensation on the substrate's surface.
5 Key Methods Explained
1. Physical Vapor Deposition (PVD)
Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) are the two primary methods used for vapor deposition.
PVD includes techniques like sputtering, evaporation, and sublimation.
In PVD, the material is physically vaporized from a source and then deposited onto the substrate.
2. Chemical Vapor Deposition (CVD)
In contrast, CVD involves chemical reactions from the vapor phase.
Gaseous precursors react to form a solid thin film on the substrate.
CVD is particularly effective for producing high-quality solid films and coatings.
3. Thermal Evaporation
Thermal Evaporation is a type of PVD.
It uses resistive heating to evaporate solid material in a high vacuum chamber, creating high vapor pressure.
The evaporated material then coats the surface of the substrate.
This technique is widely used in industries for creating metal bonding layers in solar cells, thin-film transistors, semiconductor wafers, and carbon-based OLEDs.
4. Applications of Thin Film Deposition
Applications of thin film deposition are extensive.
They range from mechanical films that are super hard and corrosion-resistant to functional films like magnetic recording, information storage, photosensitive, thermosensitive, superconducting, and photoelectric conversion films.
Additionally, decorative coatings can also be prepared using this technology.
5. Choosing Between PVD and CVD
The choice between PVD and CVD depends on the specific requirements of the film.
These requirements include its composition, purity, morphology, thickness, microstructure, and other functional properties.
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