Lab Materials

Barium Titanate (BaTiO3) Sputtering Target / Powder / Wire / Block / Granule

Name: Barium Titanate (BaTiO3) Sputtering Target / Powder / Wire / Block / Granule
Brand: Kintek Solution
SKU: LM-BaTiO3
Rating: 4.76 (19 reviews)

Item Number : LM-BaTiO3

Price varies based on specs and customizations

Chemical Formula: BaTiO3
Purity: 3N5
Shape: discs / wire / block / powder / plates / column targets / step target / custom-made

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At reasonable prices, we offer Barium Titanate (BaTiO3) materials for laboratory use. Our expertise lies in producing and tailoring Barium Titanate (BaTiO3) materials of varying purities, shapes, and sizes to meet your unique requirements.

We provide a wide range of specifications and sizes for different types of sputtering targets (including circular, square, tubular, and irregular), coating materials, cylinders, cones, particles, foils, powders, 3D printing powders, nanometer powders, wire rods, ingots, and blocks, among others.

Details

Barium Titanate (BaTiO3) Sputtering Target

About Barium Titanate (BaTiO3)

Barium Titanate is a crystalline solid used in photo optic applications, and is a dielectric ceramic used in capacitors, with high dielectric constant values up to 7,000. Polycrystalline barium titanate has a positive temperature coefficient of resistance, making it useful for thermistors and self-regulating electric heating systems.

While it has been largely replaced by PZT as a piezoelectric material, barium titanate crystals still find use in nonlinear optics and have high beam-coupling gain. It can be doped with various elements for photorefractive applications and displays electrooptic modulation to frequencies over 40 GHz in thin films.

Researchers have recently created nanofiber mats of zinc titanate that can efficiently scrub sulfur impurities from petroleum-based fuels, a nanotechnology-based development that may lower the cost of fuel technologies in the future.

Barium titanate is also widely used in thermistors and positive temperature coefficient heating elements, with specific applications including overcurrent protection for motors, ballasts for fluorescent lights, automobile cabin air heaters, and consumer space heaters.

Ingredient Quality Control

Raw material composition analysis: Through the use of equipment such as ICP and GDMS, the content of metal impurities is detected and analyzed to ensure that it meets the purity standard;

Non-metallic impurities are detected by equipment such as carbon and sulfur analyzers, nitrogen and oxygen analyzers.
Metallographic flaw detection analysis: The target material is inspected using flaw detection equipment to ensure that there are no defects or shrinkage holes inside the product;

Through metallographic testing, the internal grain structure of the target material is analyzed to ensure that the grains are fine and dense.
Appearance and dimension inspection: Product dimensions are measured using micrometers and precision calipers to ensure compliance with drawings;

The surface finish and cleanliness of the product are measured using a surface cleanliness meter.

Conventional Sputtering Target Sizes

Preparation process: hot isostatic pressing, vacuum melting, etc.
Sputtering target shape: plane sputtering target, multi-arc sputtering target, step sputtering target, special-shaped sputtering target
Round sputtering target size: Diameter: 25.4mm / 50mm / 50.8mm / 60mm / 76.2mm / 80mm / 100mm / 101.6mm / 152.4mm
Thickness: 3mm / 4mm / 5mm / 6mm / 6.35mm
Size can be customized.
Square sputtering target size: 50×50×3mm / 100×100×4mm / 300×300×5mm, size can be customized

Available Metal Forms

Metal Forms Details

We manufacture almost all the metals listed on the periodic table in a wide range of forms and purities, as well as standard sizes and dimensions. We can also produce custom-made products to meet specific customer requirements, such as size, shape, surface area, composition, and more. The following list provides a sample of the forms we offer, but it is not exhaustive. If you need laboratory consumables, please contact us directly to request a quote.

Flat/Planar Forms: Board, Film, Foil, Microfoil, Microleaf, Paper, Plate, Ribbon, Sheet, Strip, Tape, Wafer
Preformed Shapes: Anodes, Balls, Bands, Bars, Boats, Bolts, Briquettes, Cathodes, Circles, Coils, Crucibles, Crystals, Cubes, Cups, Cylinders, Discs, Electrodes, Fibers, Filaments, Flanges, Grids, Lenses, Mandrels, Nuts, Parts, Prisms, Pucks, Rings, Rods, Shapes, Shields, Sleeves, Springs, Squares, Sputtering Targets, Sticks, Tubes, Washers, Windows, Wires
Microsizes: Beads, Bits, Capsules, Chips, Coins, Dust, Flakes, Grains, Granules, Micropowder, Needles, Particles, Pebbles, Pellets, Pins, Pills, Powder, Shavings, Shot, Slugs, Spheres, Tablets
Macrosizes: Billets, Chunks, Cuttings, Fragments, Ingots, Lumps, Nuggets, Pieces, Punchings, Rocks, Scraps, Segments, Turnings
Porous and Semi-Porous: Fabric, Foam, Gauze, Honeycomb, Mesh, Sponge, Wool
Nanoscale: Nanoparticles, Nanopowders, Nanofoils, Nanotubes, Nanorods, Nanoprisms
Others: Concentrate, Ink, Paste, Precipitate, Residue, Samples, Specimens

KinTek specializes in the manufacturing of high-purity and ultra-high-purity materials with a purity range of 99.999% (5N), 99.9999% (6N), 99.99995% (6N5), and in some cases, up to 99.99999% (7N). Our materials are available in specific grades, including UP/UHP, semiconductor, electronic, deposition, fiber optic, and MBE grades. Our high-purity metals, oxides, and compounds are specifically crafted to meet the rigorous demands of high-technology applications and are ideal for use as dopants and precursor materials for thin film deposition, crystal growth of semiconductors, and synthesis of nanomaterials. These materials find use in advanced microelectronics, solar cells, fuel cells, optical materials, and other cutting-edge applications.

Packaging

We use vacuum packaging for our high-purity materials, and each material has specific packaging tailored to its unique characteristics. For instance, our Hf sputter target is externally tagged and labeled to facilitate efficient identification and quality control. We take great care to prevent any damage that could occur during storage or transportation.

FAQ

What is Physical vapor deposition (PVD)?

Physical vapor deposition (PVD) is a technique for depositing thin films by vaporizing a solid material in a vacuum and then depositing it onto a substrate. PVD coatings are highly durable, scratch-resistant, and corrosion-resistant, making them ideal for a variety of applications, from solar cells to semiconductors. PVD also creates thin films that can withstand high temperatures. However, PVD can be costly, and the cost varies depending on the method used. For instance, evaporation is a low-cost PVD method, while ion beam sputtering is rather expensive. Magnetron sputtering, on the other hand, is more expensive but more scalable.

What is sputtering target?

A sputtering target is a material used in the process of sputter deposition, which involves breaking up the target material into tiny particles that form a spray and coat a substrate, such as a silicon wafer. Sputtering targets are typically metallic elements or alloys, although some ceramic targets are available. They come in a variety of sizes and shapes, with some manufacturers creating segmented targets for larger sputtering equipment. Sputtering targets have a wide range of applications in fields such as microelectronics, thin film solar cells, optoelectronics, and decorative coatings due to their ability to deposit thin films with high precision and uniformity.

What are high purity materials?

High purity materials refer to substances that are free from impurities and possess a high level of chemical homogeneity. These materials are essential in various industries, particularly in the field of advanced electronics, where impurities can significantly affect the performance of devices. High purity materials are obtained through various methods, including chemical purification, vapor-phase deposition, and zone refining. In the preparation of electronic grade single crystal diamond, for example, a high-purity raw material gas and an efficient vacuum system are necessary to achieve the desired level of purity and homogeneity.

What is magnetron sputtering?

Magnetron sputtering is a plasma-based coating technique used to produce very dense films with excellent adhesion, making it a versatile method for creating coatings on materials that have high melting points and cannot be evaporated. This method generates a magnetically confined plasma near the surface of a target, where positively charged energetic ions collide with the negatively charged target material, causing atoms to be ejected or "sputtered." These ejected atoms are then deposited on a substrate or wafer to create the desired coating.

How are sputtering targets made?

Sputtering targets are made using a variety of manufacturing processes depending on the properties of the target material and its application. These include vacuum melting and rolling, hot-pressed, special press-sintered process, vacuum hot-pressed, and forged methods. Most sputtering target materials can be fabricated into a wide range of shapes and sizes, with circular or rectangular shapes being the most common. Targets are usually made from metallic elements or alloys, but ceramic targets can also be used. Compound sputtering targets are also available, made from a variety of compounds including oxides, nitrides, borides, sulphides, selenides, tellurides, carbides, crystalline, and composite mixtures.

Why magnetron sputtering?

Magnetron sputtering is preferred due to its ability to achieve high precision in film thickness and density of coatings, surpassing evaporation methods. This technique is especially suitable for creating metallic or insulating coatings with specific optical or electrical properties. Additionally, magnetron sputtering systems can be configured with multiple magnetron sources.

What is sputtering target used for?

Sputtering targets are used in a process called sputtering to deposit thin films of a material onto a substrate using ions to bombard the target. These targets have a wide range of applications in various fields, including microelectronics, thin film solar cells, optoelectronics, and decorative coatings. They allow for the deposition of thin films of materials onto a variety of substrates with high precision and uniformity, making them an ideal tool for producing precision products. Sputtering targets come in various shapes and sizes and can be specialized to meet the specific requirements of the application.

What are the materials used in thin film deposition?

Thin film deposition commonly utilizes metals, oxides, and compounds as materials, each with its unique advantages and disadvantages. Metals are preferred for their durability and ease of deposition but are relatively expensive. Oxides are highly durable, can withstand high temperatures, and can be deposited at low temperatures, but can be brittle and challenging to work with. Compounds offer strength and durability, can be deposited at low temperatures and tailored to exhibit specific properties.

The selection of material for a thin film coating is dependent on the application requirements. Metals are ideal for thermal and electrical conduction, while oxides are effective in offering protection. Compounds can be tailored to suit specific needs. Ultimately, the best material for a particular project will depend on the specific needs of the application.

What are sputtering targets for electronics?

Sputtering targets for electronics are thin discs or sheets of materials such as aluminum, copper, and titanium that are used to deposit thin films onto silicon wafers to create electronic devices like transistors, diodes, and integrated circuits. These targets are used in a process called sputtering, in which atoms of the target material are physically ejected from the surface and deposited onto a substrate by bombarding the target with ions. Sputtering targets for electronics are essential in the production of microelectronics and typically require high precision and uniformity to ensure quality devices.

What are the methods to achieve optimal thin film deposition?

To achieve thin films with desirable properties, high-quality sputtering targets and evaporation materials are essential. The quality of these materials can be influenced by various factors, such as purity, grain size, and surface condition.

The purity of sputtering targets or evaporation materials plays a crucial role, as impurities can cause defects in the resulting thin film. Grain size also affects the quality of the thin film, with larger grains leading to poor film properties. Additionally, the surface condition is crucial, since rough surfaces can result in defects in the film.

To attain the highest quality sputtering targets and evaporation materials, it is crucial to select materials that possess high purity, small grain size, and smooth surfaces.

Uses of Thin Film Deposition

Zinc Oxide-Based Thin Films

ZnO thin films find applications in several industries such as thermal, optical, magnetic, and electrical, but their primary use is in coatings and semiconductor devices.

Thin-Film Resistors

Thin-film resistors are crucial for modern technology and are used in radio receivers, circuit boards, computers, radiofrequency devices, monitors, wireless routers, Bluetooth modules, and cell phone receivers.

Magnetic Thin Films

Magnetic thin films are used in electronics, data storage, radio-frequency identification, microwave devices, displays, circuit boards, and optoelectronics as key components.

Optical Thin Films

Optical coatings and optoelectronics are standard applications of optical thin films. Molecular beam epitaxy can produce optoelectronic thin-film devices (semiconductors), where epitaxial films are deposited one atom at a time onto the substrate.

Polymer Thin Films

Polymer thin films are used in memory chips, solar cells, and electronic devices. Chemical deposition techniques (CVD) offer precise control of polymer film coatings, including conformance and coating thickness.

Thin-Film Batteries

Thin-film batteries power electronic devices such as implantable medical devices, and the lithium-ion battery has advanced significantly thanks to the use of thin films.

Thin-Film Coatings

Thin-film coatings enhance the chemical and mechanical characteristics of target materials in various industries and technological fields. Anti-reflective coatings, anti-ultraviolet or anti-infrared coatings, anti-scratch coatings, and lens polarization are some common examples.

Thin-Film Solar Cells

Thin-film solar cells are essential to the solar energy industry, enabling the production of relatively cheap and clean electricity. Photovoltaic systems and thermal energy are the two main applicable technologies.

What is the lifetime of a sputtering target?

The lifetime of a sputtering target depends on factors such as the material composition, purity, and the specific application it is being used for. Generally, targets can last for several hundred to a few thousand hours of sputtering, but this can vary widely depending on the specific conditions of each run. Proper handling and maintenance can also extend the lifetime of a target. In addition, the use of rotary sputtering targets can increase runtimes and reduce the occurrence of defects, making them a more cost-effective option for high volume processes.

Factors and Parameters that Influence Deposition of Thin Films

Deposition Rate:

The rate at which the film is produced, typically measured in thickness divided by time, is crucial for selecting a technology suitable for the application. Moderate deposition rates are sufficient for thin films, while quick deposition rates are necessary for thick films. It is important to strike a balance between speed and precise film thickness control.

Uniformity:

The consistency of the film across the substrate is known as uniformity, which usually refers to film thickness but can also relate to other properties such as the index of refraction. It is important to have a good understanding of the application to avoid under- or over-specifying uniformity.

Fill Capability:

Fill capability or step coverage refers to how well the deposition process covers the substrate's topography. The deposition method used (e.g., CVD, PVD, IBD, or ALD) has a significant impact on step coverage and fill.

Film Characteristics:

The characteristics of the film depend on the application's requirements, which can be categorized as photonic, optical, electronic, mechanical, or chemical. Most films must meet requirements in more than one category.

Process Temperature:

Film characteristics are significantly affected by process temperature, which may be limited by the application.

Damage:

Each deposition technology has the potential to damage the material being deposited upon, with smaller features being more susceptible to process damage. Pollution, UV radiation, and ion bombardment are among the potential sources of damage. It is crucial to understand the limitations of the materials and tools.

View more faqs for this product

4.7

out of

5

I'm impressed by the quality of KINTEK's Sputtering Target. It's a great choice for my laboratory experiments.

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4.8

out of

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Finn Blom

4.9

out of

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KINTEK's Sputtering Target has proven to be a valuable addition to our laboratory equipment. Its precision and consistency have enhanced our research capabilities.

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4.6

out of

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The Sputtering Target from KINTEK has met all my expectations. Its durability and performance are exceptional.

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4.7

out of

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4.8

out of

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4.9

out of

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4.6

out of

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KINTEK's Sputtering Target is an excellent investment for any laboratory. It's a reliable and long-lasting product.

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4.7

out of

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I'm highly satisfied with the quality and value for money of KINTEK's Sputtering Target. It's an exceptional product.

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4.8

out of

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KINTEK's Sputtering Target has been a game-changer for our laboratory. Its technological advancements have enabled us to achieve groundbreaking results.

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4.9

out of

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4.6

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4.7

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4.8

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4.9

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I'm thrilled with the performance of KINTEK's Sputtering Target. It has significantly improved the efficiency of our laboratory processes.

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High Purity Praseodymium (Pr) Sputtering Target / Powder / Wire / Block / Granule

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High Purity Neodymium (Nd) Sputtering Target / Powder / Wire / Block / Granule

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High Purity Holmium (Ho) Sputtering Target / Powder / Wire / Block / Granule

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High Purity Silicon Dioxide (SiO2) Sputtering Target / Powder / Wire / Block / Granule

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High Purity Titanium Dioxide (TiO2) Sputtering Target / Powder / Wire / Block / Granule

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High Purity Aluminum-doped Zinc Oxide (AZO) Sputtering Target / Powder / Wire / Block / Granule

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High Purity Indium Tin Oxide (ITO) Sputtering Target / Powder / Wire / Block / Granule

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High Purity Cerium Oxide (CeO2) Sputtering Target / Powder / Wire / Block / Granule

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High Purity Samarium Oxide (Sm2O3) Sputtering Target / Powder / Wire / Block / Granule

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High Purity Neodymium Oxide (Nd2O3) Sputtering Target / Powder / Wire / Block / Granule

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High Purity Iron Oxide (Fe3O4) Sputtering Target / Powder / Wire / Block / Granule

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Tantalum Tungsten Alloy (TaW) Sputtering Target / Powder / Wire / Block / Granule

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Titanium Silicon Alloy (TiSi) Sputtering Target / Powder / Wire / Block / Granule

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Tungsten Titanium Alloy (WTi) Sputtering Target / Powder / Wire / Block / Granule

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Titanium Nickel Silver Alloy (TiNiAg) Sputtering Target / Powder / Wire / Block / Granule

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Aluminum Silicon Yttrium alloy (AlSiY) Sputtering Target / Powder / Wire / Block / Granule

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Lithium Aluminum Alloy (AlLi) Sputtering Target / Powder / Wire / Block / Granule

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Aluminum Chromium Alloy (AlCr) Sputtering Target / Powder / Wire / Block / Granule

Nickel Chromium Alloy (NiCr) Sputtering Target / Powder / Wire / Block / Granule

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Iron Gallium Alloy (FeGa) Sputtering Target / Powder / Wire / Block / Granule

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Iron Telluride (FeTe) Sputtering Target / Powder / Wire / Block / Granule

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Copper Zirconium Alloy (CuZr) Sputtering Target / Powder / Wire / Block / Granule

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Copper Nickel Alloy (CuNi) Sputtering Target / Powder / Wire / Block / Granule

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Cobalt Silicide (CoSi2) Sputtering Target / Powder / Wire / Block / Granule

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Tin Bismuth Silver Alloy (SnBiAg) Sputtering Target / Powder / Wire / Block / Granule

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Chromium Nickel Alloy (CrNi) Sputtering Target / Powder / Wire / Block / Granule

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Nickel Aluminum Alloy (NiAl) Sputtering Target / Powder / Wire / Block / Granule

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Nickel Niobium Alloy (NiNb) Sputtering Target / Powder / Wire / Block / Granule

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Iron Nickel Alloy (FeNi) Sputtering Target / Powder / Wire / Block / Granule

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Manganese Cobalt Nickel alloy (MnCoNi) Sputtering Target / Powder / Wire / Block / Granule

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Boron Nitride (BN) Sputtering Target / Powder / Wire / Block / Granule

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Aluminum Nitride (AlN) Sputtering Target / Powder / Wire / Block / Granule

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Titanium Nitride (TiN) Sputtering Target / Powder / Wire / Block / Granule

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Tungsten Sulfide (WS2) Sputtering Target / Powder / Wire / Block / Granule

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Cadmium Sulfide (CdS) Sputtering Target / Powder / Wire / Block / Granule

Boron Carbide (B4C) Sputtering Target / Powder / Wire / Block / Granule

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Hafnium Carbide (HfC) Sputtering Target / Powder / Wire / Block / Granule

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Molybdenum Carbide (Mo2C) Sputtering Target / Powder / Wire / Block / Granule

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Aluminum Boride (AlB2) Sputtering Target / Powder / Wire / Block / Granule

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Titanium Carbide (TiC) Sputtering Target / Powder / Wire / Block / Granule

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Lithium Titanate (Li2TiO3) Sputtering Target / Powder / Wire / Block / Granule

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Lithium Tantalate (LiTaO3) Sputtering Target / Powder / Wire / Block / Granule

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Antimony Sulfide (Sb2S3) Sputtering Target / Powder / Wire / Block / Granule

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Indium Selenide (In2Se3) Sputtering Target / Powder / Wire / Block / Granule

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Indium(II) Selenide (InSe) Sputtering Target / Powder / Wire / Block / Granule

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Iithium titanate (LiTiO3) Sputtering Target / Powder / Wire / Block / Granule

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Lithium cobaltate (LiCoO2) Sputtering Target / Powder / Wire / Block / Granule

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Lanthanum Fluoride (LaF3) Sputtering Target / Powder / Wire / Block / Granule

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Sodium Fluoride (NaF) Sputtering Target / Powder / Wire / Block / Granule

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Calcium Fluoride (CaF2) Sputtering Target / Powder / Wire / Block / Granule

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Potassium Fluoride (KF) Sputtering Target / Powder / Wire / Block / Granule

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Cerium Fluoride (CeF3) Sputtering Target / Powder / Wire / Block / Granule

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Strontium Fluoride (SrF2) Sputtering Target / Powder / Wire / Block / Granule

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Neodymium Fluoride (NdF3) Sputtering Target / Powder / Wire / Block / Granule

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Dysprosium Fluoride (DyF3) Sputtering Target / Powder / Wire / Block / Granule

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Samarium Fluoride (SmF3) Sputtering Target / Powder / Wire / Block / Granule

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Ytterbium Fluoride (YbF3) Sputtering Target / Powder / Wire / Block / Granule

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Yttrium Fluoride (YF3) Sputtering Target / Powder / Wire / Block / Granule

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Erbium Fluoride (ErF3) Sputtering Target / Powder / Wire / Block / Granule

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Zinc Selenide (ZnSe) Sputtering Target / Powder / Wire / Block / Granule

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