Products Lab Consumables & Materials Lab Materials High Purity Boron (B) Sputtering Target / Powder / Wire / Block / Granule
High Purity Boron (B) Sputtering Target / Powder / Wire / Block / Granule

Lab Materials

High Purity Boron (B) Sputtering Target / Powder / Wire / Block / Granule

Item Number : LM-B

Price varies based on specs and customizations


Chemical Formula
b
Purity
2N-3N
Shape
discs / wire / block / powder / plates / column targets / step target / custom-made
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We sell affordable Boron (B) materials for lab use, and specialize in tailoring them to your specific needs. 

Our Boron (B) materials come in varying purities, shapes, and sizes, including sputtering targets (circular, square, tubular, irregular), coating materials, cylinders, cones, particles, foils, powders, 3D printing powders, nanometer powders, wire rods, ingots, and blocks.

Main Products

  • Boron sputtering targets with a purity of 99-99.9% are available in standard sizes such as φ25.4×3mm, φ50×5mm, φ76.2×4mm, and φ100×3mm, and can also be customized. These targets are utilized in magnetron sputtering for coating purposes.
  • Boron particles with a purity of 99-99.9% are available in sizes ranging from 1-3mm to 3-5mm, and can also be customized. These particles are widely used in alloy smelting and the steel industry.
  • Boron powder with a purity of 99-99.9% is available in standard sizes including -300 mesh to 325 mesh, and can also be customized. This powder is extensively used in powder metallurgy sintering and target production.

Details

Boron (B) Sputtering Target
Boron (B) Sputtering Target
Boron (B) Sputtering Target
Boron (B) Sputtering Target
Boron (B) particles
Boron (B) particles
Boron (B) particles
Boron (B) particles

About Boron (B)

Boron is a versatile element with unique properties that make it valuable in a wide range of applications. Boron has an energy band gap of 1.50 to 1.56 eV, which is higher than that of either silicon or germanium. Optical characteristics include transmitting portions of the infrared.

Boron is a poor conductor of electricity at room temperature but becomes a good conductor at high temperature. Amorphous boron is used in pyrotechnic flares to provide a distinctive green color, and in rockets as an igniter. Boric acid is an important boron compound with major markets in textile products.

Boron compounds are used extensively in the manufacture of borosilicate glasses. High Purity (99.999%) Boron Oxide (B2O3) Powder and High Purity (99.999%) Boron (B) Sputtering Target are two commonly used boron compounds.

The isotope Boron-10 is used in various industries. It serves as a control for nuclear reactors, as a shield for nuclear radiation, and in instruments used for detecting neutrons. Boron nitride has remarkable properties and can be used to make a material as hard as diamond. The nitride also behaves like an electrical insulator but conducts heat like a metal.

Boron is available in various forms, with purities ranging from 99% to 99.999% (ACS grade to ultra-high purity). Elemental forms include pellets, rod, wire, and granules for evaporation source material purposes. Boron oxide is available in powder and dense pellet form for such uses as optical coating and thin film applications.

Boron fluoride is an insoluble source of fluoride for uses in which oxygen is undesirable such as metallurgy, chemical and physical vapor deposition, and some optical coatings. Boron is also available in soluble forms including chlorides and acetates. These compounds can be manufactured as solutions at specified stoichiometries.

Ingredient Quality Control

Raw material composition analysis
Through the use of equipment such as ICP and GDMS, the content of metal impurities is detected and analyzed to ensure that it meets the purity standard;

Non-metallic impurities are detected by equipment such as carbon and sulfur analyzers, nitrogen and oxygen analyzers.
Metallographic flaw detection analysis
The target material is inspected using flaw detection equipment to ensure that there are no defects or shrinkage holes inside the product;

Through metallographic testing, the internal grain structure of the target material is analyzed to ensure that the grains are fine and dense.
Appearance and dimension inspection
Product dimensions are measured using micrometers and precision calipers to ensure compliance with drawings;

The surface finish and cleanliness of the product are measured using a surface cleanliness meter.

Conventional Sputtering Target Sizes

Preparation process
hot isostatic pressing, vacuum melting, etc.
Sputtering target shape
plane sputtering target, multi-arc sputtering target, step sputtering target, special-shaped sputtering target
Round sputtering target size
Diameter: 25.4mm / 50mm / 50.8mm / 60mm / 76.2mm / 80mm / 100mm / 101.6mm / 152.4mm
Thickness: 3mm / 4mm / 5mm / 6mm / 6.35mm
Size can be customized.
Square sputtering target size
50×50×3mm / 100×100×4mm / 300×300×5mm, size can be customized

Available Metal Forms

Metal Forms Details

We manufacture almost all the metals listed on the periodic table in a wide range of forms and purities, as well as standard sizes and dimensions. We can also produce custom-made products to meet specific customer requirements, such as size, shape, surface area, composition, and more. The following list provides a sample of the forms we offer, but it is not exhaustive. If you need laboratory consumables, please contact us directly to request a quote.

  • Flat/Planar Forms: Board, Film, Foil, Microfoil, Microleaf, Paper, Plate, Ribbon, Sheet, Strip, Tape, Wafer
  • Preformed Shapes: Anodes, Balls, Bands, Bars, Boats, Bolts, Briquettes, Cathodes, Circles, Coils, Crucibles, Crystals, Cubes, Cups, Cylinders, Discs, Electrodes, Fibers, Filaments, Flanges, Grids, Lenses, Mandrels, Nuts, Parts, Prisms, Pucks, Rings, Rods, Shapes, Shields, Sleeves, Springs, Squares, Sputtering Targets, Sticks, Tubes, Washers, Windows, Wires
  • Microsizes: Beads, Bits, Capsules, Chips, Coins, Dust, Flakes, Grains, Granules, Micropowder, Needles, Particles, Pebbles, Pellets, Pins, Pills, Powder, Shavings, Shot, Slugs, Spheres, Tablets
  • Macrosizes: Billets, Chunks, Cuttings, Fragments, Ingots, Lumps, Nuggets, Pieces, Punchings, Rocks, Scraps, Segments, Turnings
  • Porous and Semi-Porous: Fabric, Foam, Gauze, Honeycomb, Mesh, Sponge, Wool
  • Nanoscale: Nanoparticles, Nanopowders, Nanofoils, Nanotubes, Nanorods, Nanoprisms
  • Others: Concentrate, Ink, Paste, Precipitate, Residue, Samples, Specimens

KinTek specializes in the manufacturing of high-purity and ultra-high-purity materials with a purity range of 99.999% (5N), 99.9999% (6N), 99.99995% (6N5), and in some cases, up to 99.99999% (7N). Our materials are available in specific grades, including UP/UHP, semiconductor, electronic, deposition, fiber optic, and MBE grades. Our high-purity metals, oxides, and compounds are specifically crafted to meet the rigorous demands of high-technology applications and are ideal for use as dopants and precursor materials for thin film deposition, crystal growth of semiconductors, and synthesis of nanomaterials. These materials find use in advanced microelectronics, solar cells, fuel cells, optical materials, and other cutting-edge applications.

Packaging

We use vacuum packaging for our high-purity materials, and each material has specific packaging tailored to its unique characteristics. For instance, our Hf sputter target is externally tagged and labeled to facilitate efficient identification and quality control. We take great care to prevent any damage that could occur during storage or transportation.

FAQ

What are high purity materials?

High purity materials refer to substances that are free from impurities and possess a high level of chemical homogeneity. These materials are essential in various industries, particularly in the field of advanced electronics, where impurities can significantly affect the performance of devices. High purity materials are obtained through various methods, including chemical purification, vapor-phase deposition, and zone refining. In the preparation of electronic grade single crystal diamond, for example, a high-purity raw material gas and an efficient vacuum system are necessary to achieve the desired level of purity and homogeneity.

What is sputtering target?

A sputtering target is a material used in the process of sputter deposition, which involves breaking up the target material into tiny particles that form a spray and coat a substrate, such as a silicon wafer. Sputtering targets are typically metallic elements or alloys, although some ceramic targets are available. They come in a variety of sizes and shapes, with some manufacturers creating segmented targets for larger sputtering equipment. Sputtering targets have a wide range of applications in fields such as microelectronics, thin film solar cells, optoelectronics, and decorative coatings due to their ability to deposit thin films with high precision and uniformity.

How are sputtering targets made?

Sputtering targets are made using a variety of manufacturing processes depending on the properties of the target material and its application. These include vacuum melting and rolling, hot-pressed, special press-sintered process, vacuum hot-pressed, and forged methods. Most sputtering target materials can be fabricated into a wide range of shapes and sizes, with circular or rectangular shapes being the most common. Targets are usually made from metallic elements or alloys, but ceramic targets can also be used. Compound sputtering targets are also available, made from a variety of compounds including oxides, nitrides, borides, sulphides, selenides, tellurides, carbides, crystalline, and composite mixtures.

What is sputtering target used for?

Sputtering targets are used in a process called sputtering to deposit thin films of a material onto a substrate using ions to bombard the target. These targets have a wide range of applications in various fields, including microelectronics, thin film solar cells, optoelectronics, and decorative coatings. They allow for the deposition of thin films of materials onto a variety of substrates with high precision and uniformity, making them an ideal tool for producing precision products. Sputtering targets come in various shapes and sizes and can be specialized to meet the specific requirements of the application.

What are sputtering targets for electronics?

Sputtering targets for electronics are thin discs or sheets of materials such as aluminum, copper, and titanium that are used to deposit thin films onto silicon wafers to create electronic devices like transistors, diodes, and integrated circuits. These targets are used in a process called sputtering, in which atoms of the target material are physically ejected from the surface and deposited onto a substrate by bombarding the target with ions. Sputtering targets for electronics are essential in the production of microelectronics and typically require high precision and uniformity to ensure quality devices.

What is the lifetime of a sputtering target?

The lifetime of a sputtering target depends on factors such as the material composition, purity, and the specific application it is being used for. Generally, targets can last for several hundred to a few thousand hours of sputtering, but this can vary widely depending on the specific conditions of each run. Proper handling and maintenance can also extend the lifetime of a target. In addition, the use of rotary sputtering targets can increase runtimes and reduce the occurrence of defects, making them a more cost-effective option for high volume processes.
View more faqs for this product

4.7

out of

5

KINTEK Solution's boron materials are of exceptional quality and provide consistent results. Highly recommended for lab applications.

Haruna Wakai

4.8

out of

5

KINTEK's boron sputtering targets have met our stringent quality standards. We are pleased with the overall performance and reliability.

Dr. Javier Bernal

4.9

out of

5

Excellent customer service and prompt delivery. KINTEK Solution has been a reliable partner for our laboratory's sputtering needs.

Annabel Schmidt

4.7

out of

5

KINTEK's boron materials have enabled us to achieve high-quality thin films with precise control. Highly satisfied with the results.

Prof. Mohamed Al-Ali

4.8

out of

5

KINTEK's boron sputtering targets have been instrumental in our research projects. The purity and uniformity are exceptional.

Mr. Juan Perez

4.9

out of

5

KINTEK's boron materials have exceeded our expectations. The purity and consistency have contributed to our successful experiments.

Dr. Isabella Rossi

4.7

out of

5

KINTEK's boron sputtering targets have proven to be reliable and durable. We have experienced minimal downtime, leading to increased productivity.

Ms. Olivia Brown

4.8

out of

5

KINTEK's boron materials have enabled us to explore new possibilities in thin-film technology. The quality and consistency are remarkable.

Prof. Chen Li

4.9

out of

5

KINTEK's boron sputtering targets have met our demanding specifications. We have witnessed improved film properties and enhanced performance.

Mr. Ivan Ivanov

4.7

out of

5

KINTEK's boron materials have played a crucial role in our research. The high purity and uniformity have facilitated groundbreaking discoveries.

Dr. Sarah Jones

4.8

out of

5

KINTEK's boron sputtering targets have been a game-changer for our lab. The exceptional quality has enabled us to achieve superior results.

Ms. Maria Garcia

4.9

out of

5

KINTEK's boron materials have become an integral part of our research. The purity and consistency have contributed to our success in various projects.

Prof. Ahmed Hassan

4.7

out of

5

KINTEK's boron sputtering targets have exceeded our expectations. The quality and reliability have enabled us to streamline our production process.

Mr. Kevin Smith

4.8

out of

5

KINTEK's boron materials have been a valuable addition to our laboratory. The purity and consistency have allowed us to achieve precise and reproducible results.

Dr. Emily White

4.9

out of

5

KINTEK's boron sputtering targets have been instrumental in our research. The high purity and uniformity have enabled us to explore new frontiers in thin-film technology.

Ms. Aylin Yilmaz

4.7

out of

5

KINTEK's boron materials have been a reliable partner for our laboratory. The exceptional quality and consistency have contributed to our success in various projects.

Prof. Jean-Pierre Dubois

4.8

out of

5

KINTEK's boron sputtering targets have been a game-changer for our manufacturing process. The improved quality and reliability have resulted in increased productivity and reduced downtime.

Mr. Lars Jensen

4.9

out of

5

KINTEK's boron materials have been a valuable addition to our research. The purity and consistency have allowed us to achieve breakthroughs in our experiments.

Dr. Anna Khan

PDF - High Purity Boron (B) Sputtering Target / Powder / Wire / Block / Granule

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Catalog of Lab Materials

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Catalog of High Purity Materials

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Catalog of Sputtering Targets

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