Chemical vapor deposition (CVD) is a method used to create high-quality coatings on the surfaces of objects, known as substrates, within a reaction chamber. This process involves the chemical reactions of volatile precursors, which are substances in gaseous or vapor states, with heated substrates to deposit thin-film coatings. The precursors are often combined with inert gases like argon or helium to prevent unwanted surface reactions and safely transport them to the chamber.
During CVD, a gas or vapor is introduced into the processing chamber, where it initiates a chemical reaction that deposits a thin coating of material onto the substrate. To enhance the process and improve the quality of the thin layer formed, the substrate is typically heated. CVD is utilized in various applications, such as the fabrication of thin-film solar cells, semiconductor devices, coatings for tools, and other industrial goods. The method allows for the creation of thin films with specific features and characteristics, making it a highly accurate and controllable technique.
In CVD, volatile precursors decompose on a heated substrate surface in the reaction chamber, creating chemical by-products that are emitted from the chamber along with unreacted volatile precursors. Materials deposited via CVD include silicides, metal oxides, sulfides, and arsenides. The deposition method is classified based on the chemical process it starts with, and it is commonly used to produce thin films and coatings of very high quality.
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