When it comes to sputtering, there are two main methods: RF (Radio Frequency) and DC (Direct Current) sputtering.
The primary difference between these two methods lies in the power source and how they ionize the gas and sputter the target material.
1. Power Source and Pressure Requirements
DC Sputtering
DC sputtering uses a DC power source.
This power source typically requires 2,000-5,000 volts.
It operates at higher chamber pressures, around 100 mTorr.
This can lead to more collisions between charged plasma particles and the target material.
RF Sputtering
RF sputtering utilizes an AC power source.
This power source has a frequency of 13.56 MHz and requires 1,012 volts or higher.
It can maintain the gas plasma at a significantly lower pressure, under 15 mTorr.
This reduces the number of collisions and provides a more direct pathway for sputtering.
2. Target Material Suitability
DC Sputtering
DC sputtering is ideal for conductive materials.
It directly ionizes the gas plasma using electron bombardment.
However, it can cause charge build-up on non-conductive targets.
This charge build-up repels further ion bombardment and can halt the sputtering process.
RF Sputtering
RF sputtering is effective for both conductive and non-conductive materials.
The alternating current prevents charge build-up on the target.
It neutralizes the positive ions collected on the target surface during the positive half-cycle.
It sputters target atoms during the negative half-cycle.
3. Mechanism of Sputtering
DC Sputtering
DC sputtering involves direct ion bombardment of the target by energetic electrons.
This can lead to arcing and cessation of the sputtering process if the target is non-conductive.
RF Sputtering
RF sputtering uses kinetic energy to remove electrons from gas atoms.
This creates a plasma that can sputter both conductive and non-conductive targets effectively without the risk of charge build-up.
4. Frequency and Discharge
RF Sputtering
RF sputtering requires a frequency of 1 MHz or higher.
This is crucial for maintaining the sputtering process on non-conductive materials.
DC Sputtering
DC sputtering does not require high frequencies for discharge.
This makes it simpler in terms of power supply requirements but less versatile for different target materials.
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