Magnetron plasma is a type of plasma that is created in magnetron sputtering, which is a plasma vapor deposition (PVD) process.
In magnetron sputtering, a plasma is formed and positively charged ions are accelerated by an electrical field towards a negatively charged electrode or "target".
This target is typically made of the material that is to be deposited onto a substrate.
The positive ions in the plasma are accelerated by potentials ranging from a few hundred to a few thousand electron volts and strike the target with enough force to dislodge and eject atoms from its surface.
These atoms are then ejected in a typical line-of-sight cosine distribution and condense on surfaces that are placed in proximity to the magnetron sputtering cathode.
The magnetron, which is the design of high-deposition-rate sputtering sources, plays a crucial role in magnetron sputtering.
It is a magnetically assisted discharge where a permanent magnet or electromagnet is added to create lines of magnetic flux parallel to the target surface.
This magnetic field concentrates and intensifies the plasma near the target surface, resulting in enhanced ion bombardment and sputtering rate.
The magnetic field in magnetron sputtering also controls the transmission path of the plasma.
The magnetic lines formed by the magnetron extend from one end of the target to the other.
This magnetic field trapping effect increases the ratio of ionization and the rate of coating deposition at low temperatures.
It also helps reduce gas incorporation in the film and minimize energy losses in the sputtered atoms.
Overall, magnetron sputtering is a plasma-based coating technique that involves the collision of positively charged energetic ions from a magnetically confined plasma with a negatively charged target material.
This collision causes the ejection or sputtering of atoms from the target, which are then deposited onto a substrate.
Magnetron sputtering is known for its ability to produce high-quality films and its scalability compared to other PVD methods.
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