When it comes to applying Diamond-like Carbon (DLC) coatings, temperature plays a crucial role.
DLC coatings are typically applied at temperatures below 200°C.
HEF's specific deposition technology allows for the application of DLC coatings at around 170°C.
DLC films can be deposited using the radio frequency plasma-assisted chemical vapor deposition (RF PECVD) method.
This method allows for the deposition of carbon films with a wide range of optical and electrical properties.
The films have good adhesion to many substrates and can be deposited at relatively low temperatures.
However, highly containing sp3 carbon films, known as polycrystalline diamond, are usually produced by high-temperature chemical vapor deposition (CVD) processes.
Diamond-like carbon films (DLC), in their different forms, can be deposited at even lower temperatures of around 300°C with high adhesive strength using adequate bonding layers.
Plasma-enhanced chemical vapor deposition (PECVD) can also be used to produce DLC coatings.
These coatings are hard, scratch-resistant, and have good barrier properties.
PECVD offers advantages such as lower temperatures, chemical stability, fewer toxic byproducts, quick processing time, and high deposition rates.
Overall, DLC coatings can be deposited at various temperatures depending on the specific deposition method and desired properties.
What Temperature is DLC Applied? 5 Key Points to Know
1. Typical Deposition Temperature
DLC coatings are typically applied at temperatures below 200°C.
2. HEF's Specific Deposition Technology
HEF's technology allows for the application of DLC coatings at around 170°C.
3. RF PECVD Method
DLC films can be deposited using the radio frequency plasma-assisted chemical vapor deposition (RF PECVD) method.
4. Low-Temperature Deposition
The films have good adhesion to many substrates and can be deposited at relatively low temperatures.
5. PECVD Advantages
Plasma-enhanced chemical vapor deposition (PECVD) offers advantages such as lower temperatures, chemical stability, fewer toxic byproducts, quick processing time, and high deposition rates.
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