Measuring the thickness of deposited films is crucial for various applications, from research to industrial processes.
There are several methods available, each suited to different film thicknesses and material properties.
4 Key Methods Explained
1. Stylus Profilometry and Interferometry
Stylus profilometry and interferometry are mechanical methods that require a groove or step between the film and the substrate.
These grooves are created either by masking parts of the substrate or by selectively removing parts of the deposited film.
In stylus profilometry, a stylus physically traces the surface profile, measuring the height difference between the film and the substrate.
Interferometry, on the other hand, uses the interference of light waves to measure thickness.
This method requires a highly reflective surface to generate interference fringes, which are then analyzed to determine the film thickness.
Both methods measure thickness at specific points, making film uniformity a critical factor for accuracy.
2. Transmission Electron Microscopy (TEM)
TEM is used for analyzing thin films, particularly in the range of a few nanometers to 100 nm.
This method involves the use of a focused ion beam (FIB) to prepare suitable sample thicknesses.
TEM provides high-resolution imaging, allowing for detailed analysis of film structure and thickness.
It is particularly useful for conductive and semiconductive materials.
3. Spectrophotometry
Spectrophotometry is employed for measuring film thicknesses between 0.3 to 60 µm.
This method utilizes the principle of interference, where the interference of light waves is affected by the thickness and refractive index of the film.
By analyzing the interference patterns, the thickness of the film can be determined.
This method is effective for transparent films and requires knowledge of the film's refractive index.
4. Selection of Measurement Technique
The choice of measurement technique depends on factors such as the transparency of the material, the required accuracy, and additional information needed beyond thickness, such as refractive index, surface roughness, and structural properties.
For elemental composition analysis, techniques like scanning electron microscopy (SEM) equipped with an energy dispersive spectroscopy (EDS) detector are used, which can identify and quantify elements and compounds in the film.
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