Physical Vapor Deposition (PVD) is a top-down process. This is evident from the description of the PVD process, particularly in the method of Thermal Evaporation, where the material to be deposited is heated in a vacuum chamber until it vaporizes and then condenses onto a substrate positioned above the source material.
Explanation of Top-Down Nature: In the context of PVD, particularly Thermal Evaporation, the process begins with a solid material located at the bottom of a vacuum chamber. This material is heated until it reaches its vapor pressure and forms a vapor cloud. The vapor then rises and deposits onto the substrate, which is typically positioned above the source. This upward movement of the vapor from the source to the substrate indicates a top-down approach, as the material is removed from a bulk source (the solid material) and deposited onto a surface (the substrate).
Comparison with Bottom-Up Methods: Contrastingly, bottom-up methods like Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) involve building up materials atom by atom or molecule by molecule on the substrate surface. In these methods, the growth of the film is initiated at the atomic or molecular level on the substrate, which is fundamentally different from the PVD process where material is removed from a bulk source and deposited onto the substrate.
Conclusion: Therefore, based on the mechanisms described, PVD, especially in the context of Thermal Evaporation, is classified as a top-down process, as it involves the removal of material from a larger source and its deposition onto a substrate, rather than building up the material from the atomic or molecular level on the substrate surface.
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