Physical Vapor Deposition (PVD) is a process used to create thin films on various substrates.
This technique involves several critical steps to ensure the quality and precision of the deposited film.
Here’s a detailed look at the four main steps involved in PVD.
What are the 4 Key Steps in Physical Vapor Deposition?
1. Evaporation
The material to be deposited is converted into vapor by physical means.
This can be achieved by bombarding a target with a high-energy source like electrons or ions.
This process dislodges atoms from the surface of the target and vaporizes them.
2. Transportation
The vaporized atoms are then transported across a region of low pressure from their source to the substrate or the object to be coated.
This movement of the vaporized atoms can be achieved through various methods, such as diffusion or by using a carrier gas.
3. Reaction
Once the vaporized atoms reach the substrate, they undergo a condensation process.
This involves the atoms undergoing a phase change from a vapor to a solid state.
The atoms on the substrate surface then react with each other or with other elements present to form a thin film.
4. Deposition
The condensed vapor forms a thin film on the substrate surface.
The thickness and properties of this film can be controlled by adjusting various parameters during the PVD process, such as the temperature, pressure, and deposition time.
It is important to note that PVD processes are typically carried out under vacuum conditions.
This helps to prevent contamination and ensure the purity of the deposited thin film.
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