Preparing nano thin films involves two primary techniques: Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD).
2 Techniques for Preparing Nano Thin Films: CVD and PVD
Chemical Vapor Deposition (CVD)
CVD is a method used to create high-purity and effective solid thin films.
In this process, the substrate is placed inside a reactor where it is exposed to volatile gases.
A solid layer is formed on the substrate surface through chemical reactions between the gas used and the substrate.
CVD can produce high-purity single- or polycrystalline or even amorphous thin films.
It allows for the synthesis of both pure and complex materials at the desired purity at low temperatures.
The chemical and physical properties of the films can be adjusted by controlling parameters such as temperature, pressure, gas flow rate, and gas concentration.
Physical Vapor Deposition (PVD)
PVD involves the production of thin films by condensing evaporated materials released from a source (target material) on the substrate surface.
The sub-methods of PVD include sputtering and evaporation.
PVD techniques are widely used for the fabrication of thin (submicro to nano) or thick (>5 μm) solid films on a suitable substrate.
Common PVD techniques include sputtering, electrophoretic deposition, electron beam PVD (e-beam-PVD), pulsed laser deposition (PLD), atomic layer deposition (ALD), and molecular beam epitaxy techniques.
These methods are crucial for achieving high purity and low levels of defects in the deposited films.
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