Knowledge What is the Difference Between Sputtering and E-Beam? 5 Key Points to Consider
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Tech Team · Kintek Solution

Updated 3 months ago

What is the Difference Between Sputtering and E-Beam? 5 Key Points to Consider

Sputtering and electron beam evaporation are both methods used in physical vapor deposition (PVD) to create thin films.

However, these two techniques have different processes and characteristics.

5 Key Points to Consider

What is the Difference Between Sputtering and E-Beam? 5 Key Points to Consider

1. Deposition Process

Sputtering involves using energized plasma atoms, usually argon, to hit a negatively charged source material.

These energized atoms cause atoms from the source material to break off and stick to a substrate, forming a thin film.

Sputtering happens within a closed magnetic field and is done in a vacuum.

On the other hand, electron beam evaporation uses an electron beam to focus on a source material, producing very high temperatures that vaporize the material.

This process also occurs within a vacuum or deposition chamber.

2. Temperature

Sputtering is performed at a lower temperature compared to electron beam evaporation.

3. Deposition Rate

Electron beam evaporation typically has a higher deposition rate than sputtering, especially for dielectrics.

4. Coating Coverage

Sputtering provides better coating coverage for complex substrates.

5. Applications

Electron beam evaporation is more commonly used for high-volume batch production and thin-film optical coatings.

Sputtering is used in applications that require high levels of automation.

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