Sputtering and electron beam evaporation are both methods used in physical vapor deposition (PVD) to create thin films.
However, these two techniques have different processes and characteristics.
5 Key Points to Consider
1. Deposition Process
Sputtering involves using energized plasma atoms, usually argon, to hit a negatively charged source material.
These energized atoms cause atoms from the source material to break off and stick to a substrate, forming a thin film.
Sputtering happens within a closed magnetic field and is done in a vacuum.
On the other hand, electron beam evaporation uses an electron beam to focus on a source material, producing very high temperatures that vaporize the material.
This process also occurs within a vacuum or deposition chamber.
2. Temperature
Sputtering is performed at a lower temperature compared to electron beam evaporation.
3. Deposition Rate
Electron beam evaporation typically has a higher deposition rate than sputtering, especially for dielectrics.
4. Coating Coverage
Sputtering provides better coating coverage for complex substrates.
5. Applications
Electron beam evaporation is more commonly used for high-volume batch production and thin-film optical coatings.
Sputtering is used in applications that require high levels of automation.
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