The magnetic field sputtering of a DC magnetron involves the use of a magnetic field to enhance the efficiency of the sputtering process.
This is done by trapping electrons near the target surface.
This increases the ionization of the gas and the deposition rate of the thin film.
5 Key Points to Understand the Magnetic Field Sputtering of a DC Magnetron
1. Mechanism of Sputtering
In DC magnetron sputtering, a direct current power supply is used to create a plasma near the target material.
The plasma consists of gas ions that collide with the target, dislodging atoms which are then ejected into the gas phase.
This process is fundamental to the deposition of thin films.
2. Role of Magnetic Field
The addition of a magnetic field in magnetron sputtering is crucial.
This field is arranged behind the cathode plate and interacts with the electric field to deflect the charge carriers (electrons) onto cycloid orbits.
This movement increases the time the electrons spend near the target, enhancing the ionization of the gas.
The ions, due to their larger mass, are less affected by the magnetic field and primarily impact the target directly below, leading to the formation of erosion trenches typical in magnetron sputtering.
3. Enhancement of Sputtering Rate
The magnetic field not only increases the ionization efficiency but also the sputtering rate.
This is quantified by a formula that considers factors such as ion flux density, number of target atoms, atomic weight, distance between target and substrate, and the velocities of the sputtered atoms.
The increased ionization allows the process to be run at lower pressures and voltages compared to conventional sputtering.
4. Confinement of Plasma and Secondary Electrons
The magnetic field configuration in magnetron sputtering is designed to confine the plasma and secondary electrons close to the target.
This confinement prevents the electrons from reaching the substrate and potentially damaging the thin film being deposited.
The magnetic field lines are strategically arranged to optimize this confinement, with variations in the configuration affecting the ionization efficiency and deposition rate.
5. Types of Magnetron Sputtering
There are different configurations of magnetron sputtering, including balanced and unbalanced magnetron sputtering.
In balanced configurations, the plasma is confined to the target region, while in unbalanced configurations, some magnetic field lines are directed towards the substrate, influencing the uniformity of the deposition.
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