Magnetron sputtering is used for various reasons:
1. Higher Deposition Rate: Magnetron sputtering is a high-rate vacuum deposition technique, meaning it can deposit materials onto substrates at a faster rate compared to other methods. This is advantageous for industries that require large-scale production or need to meet tight deadlines.
2. Enhanced Ionization: The use of a magnetic field in magnetron sputtering traps secondary electrons close to the target. These electrons follow helical paths around the magnetic field lines, increasing the number of ionizing collisions with the neutral gas near the target. This enhanced ionization leads to a higher sputter rate, allowing for more efficient deposition of atoms onto the substrate.
3. Lower Pressure Operation: The magnetic field in magnetron sputtering enables the plasma to be sustained at lower pressures. This has multiple benefits - it reduces gas incorporation in the film, resulting in higher film quality, and minimizes energy losses in the sputtered atoms. Lower pressure operation also helps to prevent overheating or damage to the object being coated.
4. Control of Plasma Transmission Path: The magnetic field in magnetron sputtering controls the transmission path of the plasma. The magnetic lines formed by the magnetic field direct the plasma from one end of the target to the other. This control over the plasma transmission path allows for efficient coating deposition and helps maintain the desired coating surface.
5. Scalability and Versatility: Magnetron sputtering is known for its exceptional scalability compared to other physical vapor deposition methods. It can be used for various applications and can accommodate different geometric configurations of targets, such as circular, rectangular, or tubular forms. This versatility makes magnetron sputtering a widely used technique in industries such as microelectronics and architectural glass.
In summary, magnetron sputtering is used because it offers higher deposition rates, enhanced ionization, lower pressure operation, control over plasma transmission path, and scalability for different applications. These advantages make it a preferred method for coating deposition on metallic substrates.
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