The methods of thin film fabrication include chemical deposition and physical deposition.
Chemical deposition methods involve the reaction of a precursor fluid on the substrate, resulting in the formation of a thin layer on the solid. Some popular chemical deposition methods include electroplating, sol-gel, dip coating, spin coating, chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD), and atomic layer deposition (ALD). These methods offer benefits such as simplicity in fabrication, excellent film uniformity, the capacity to cover surfaces of any size and over vast areas, and low processing temperature. However, they may require sophisticated equipment and cleanroom facilities.
Physical deposition methods include physical vapor deposition (PVD) and various techniques within it. PVD methods involve the deposition of atoms or molecules onto a substrate through physical means. Sputtering is a commonly used PVD technique where argon ions, created by glow discharge under vacuum, sputter out target atoms/molecules, which adhere to the substrates and form a thin film. Other techniques within PVD include thermal evaporation, carbon coating, electron beam, and pulsed laser deposition (PLD). PVD methods are known for their good accuracy and uniformity.
Additionally, there are cost-effective thin film coating methods such as dip-coating, spin-coating, spray-coating, blade-coating, and roll-coating. These methods have their own advantages and disadvantages depending on the proposed application. They may not be suitable for large-scale production due to certain limitations. However, they offer thin films with good homogeneity and low surface roughness.
Overall, the choice of thin film fabrication method depends on factors such as the type and size of the substrate, thickness and surface roughness requirements, economic considerations, and the availability of equipment and facilities.
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