Vapor deposition is a technique used to create thin films or coatings on a substrate.
It involves the process of vaporizing solid or liquid materials into atoms or molecules.
These atoms or molecules are then transported through a vacuum or low-pressure gaseous/plasma environment to the substrate.
Once the atoms or molecules reach the substrate, they condense and form a thin film.
7 Key Points to Understand
1. Different Methods of Vapor Deposition
There are different methods of vapor deposition, such as physical vapor deposition (PVD).
2. Physical Vapor Deposition (PVD)
In PVD, the atoms or molecules are removed from a source using physical means, such as sputter deposition.
3. Sputter Deposition
In sputter deposition, the atoms are released from a solid or liquid source through momentum exchange.
4. Vapor Transport
During the vapor deposition process, the atoms or molecules are conveyed in the form of vapor through a vacuum or low-pressure gaseous/plasma environment.
5. Reactive Deposition
Plasma or ions are often present in the vapor phase. Reactive gas can also be introduced to the vapor during the deposition process, resulting in reactive deposition.
6. Film Formation
The deposition material is converted into a vapor in a sputter chamber under low pressure, usually a partial vacuum. The vapor then condenses onto the substrate material in the chamber, forming a thin film.
7. Control of Film Thickness
The thickness of the film can be controlled by the duration of the sputtering process, as well as other factors such as the mass of the materials involved and the energy level of the coating particles.
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