Physical vapor deposition (PVD) is a method used to create thin films on materials.
This process involves turning materials from a solid or liquid state into a vapor.
The vapor then condenses onto a substrate, forming a thin film.
PVD is commonly used to create coatings of pure metals, metallic alloys, and ceramics.
These coatings typically have a thickness ranging from 1 to 10 micrometers.
What is Physical Vapor Deposition Process? 5 Key Points Explained
1. Transition from Condensed to Vapor Phases
PVD involves the transition of materials from their condensed to vapor phases.
This transition is crucial for depositing thin films onto a substrate.
2. Various Thin Film Deposition Techniques
There are several techniques for achieving PVD.
All these techniques share the commonality of physically removing atoms from a source.
3. Sputter Deposition
One popular technique is sputter deposition.
In this method, atoms are released from a solid or liquid source through momentum exchange.
4. Controlled Atmosphere in a Chamber
PVD is typically undertaken in a chamber with a controlled atmosphere at reduced pressure.
This environment is essential for the process to occur effectively.
5. Steps in the PVD Process
The PVD process by sputtering involves three main steps:
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Converting the material to be deposited into vapor.
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Transporting the vapor across a low-pressure region from its source to the substrate.
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Condensing the vapor on the substrate to form the thin film.
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