Magnetron sputtering is a physical vapor deposition (PVD) technique.
It uses a magnetic field to enhance the ionization of a target material.
This leads to the deposition of thin films onto a substrate.
What is the Mechanism of Sputtering in Magnetron? (3 Key Steps Explained)
1. Gas Introduction and Plasma Formation
An inert gas, typically argon, is introduced into a high vacuum chamber.
The magnetron, positioned near the target material, generates a magnetic field.
This magnetic field confines electrons near the target surface.
This confinement increases the probability of collisions between electrons and argon atoms.
These collisions lead to the formation of a plasma consisting of argon ions and free electrons.
2. Ionization and Sputtering
A high negative voltage is applied between the target (cathode) and the anode.
This voltage ionizes the argon gas and creates a plasma.
The positively charged argon ions are accelerated towards the negatively charged target material due to the electric field.
When these high-energy ions collide with the target, they cause atoms from the target surface to be ejected or "sputtered" into the vacuum environment.
3. Deposition onto Substrate
The ejected atoms from the target material travel through the vacuum.
They deposit onto the surface of the substrate, forming a thin film.
This process is controlled to ensure uniform and precise deposition.
Magnetron sputtering is suitable for various applications, including the creation of metallic or insulating coatings for optical and electrical purposes.
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