The sputtering rate is a crucial concept in the field of material science.
It refers to the number of monolayers per second that are removed from the surface of a target material.
This rate is influenced by several factors.
One of the main factors is the sputter yield.
The sputter yield is the number of atoms ejected per incident ion.
It primarily depends on the target material, the mass of the bombarding particles, and the energy of the bombarding particles.
Another factor is the molar weight of the target material.
The material density also plays a role.
Lastly, the ion current density is a significant factor.
In sputter deposition processes, the sputtering rate is an important parameter.
It determines the rate at which the target material is removed and deposited onto the sample surface.
However, the sputtering rate can vary depending on several conditions.
These conditions include the sputter current, sputter voltage, pressure, distance from target to sample, sputter gas, target thickness, and sample material.
Calculating the exact deposition rate can be difficult due to the complexity and variability of these parameters.
Therefore, it is recommended to use a thickness monitor to measure the actual deposited coating thickness.
It is also important to note that the sputter rate measures the amount of material removed from the target.
The deposition rate, on the other hand, measures the amount of target material deposited on the sample surface.
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