The sputtering rate is the number of monolayers per second that are sputtered from the surface of a target material. It is influenced by several factors, including the sputter yield, the molar weight of the target material, the material density, and the ion current density. The sputter yield is the number of atoms ejected per incident ion and primarily depends on the target material, the mass of the bombarding particles, and the energy of the bombarding particles.
In the context of sputter deposition processes, the sputtering rate is an important parameter as it determines the rate at which the target material is being removed and deposited onto the sample surface. However, it is important to note that the sputtering rate can vary depending on the sputtering conditions, such as the sputter current, sputter voltage, pressure, distance from target to sample, sputter gas, target thickness, and sample material.
It is difficult to calculate the exact deposition rate due to the complexity and variability of these parameters. Therefore, it is recommended to use a thickness monitor to measure the actual deposited coating thickness. Additionally, it is worth mentioning that the sputter rate measures the amount of material removed from the target, while the deposition rate measures the amount of target material deposited on the sample surface.
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