CVD deposition refers to the process of chemical vapor deposition, which is a vacuum deposition method used to produce high-quality solid materials. The materials that can be deposited using CVD include:
1. Silicon: This includes silicon dioxide, silicon carbide, silicon nitride, and silicon oxynitride. These materials are widely used in the semiconductor industry for various applications.
2. Carbon: CVD can deposit different forms of carbon, such as carbon fiber, nanofibers, nanotubes, diamond, and graphene. Carbon materials have a wide range of applications in electronics, composites, and energy storage.
3. Fluorocarbons: These are compounds containing carbon and fluorine atoms. They are often used as insulating materials or for their low friction properties.
4. Filaments: CVD can deposit various types of filaments, which are thin flexible threads or fibers. These filaments can be made from different materials such as metals or polymers.
5. Tungsten: This is a metal that is commonly deposited using CVD. Tungsten films have high melting points and are used in applications where high temperature resistance is required.
6. Titanium nitride: This is a compound of titanium and nitrogen. It is often used as a coating material due to its high hardness and resistance to wear.
7. High-κ dielectrics: Dielectrics are insulating materials that can store and release electric energy. High-κ dielectrics have a high dielectric constant, which allows for the miniaturization of electronic devices.
In summary, CVD deposition can be used to deposit a wide range of materials including silicon, carbon, fluorocarbons, filaments, tungsten, titanium nitride, and high-κ dielectrics. These materials find applications in various industries such as electronics, semiconductors, and materials science.
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