Gold sputtering is a process used to deposit a thin layer of gold onto various surfaces such as circuit boards, metal jewelry, and medical implants. This is achieved through physical vapor deposition (PVD) in a vacuum chamber. The process involves bombarding a gold target or source material with high-energy ions, causing the gold atoms to eject or "sputter" as a fine vapor. This gold vapor then lands on the target surface, or substrate, forming a fine gold coating.
The gold sputtering process begins with a source of pure gold in solid form, typically in the shape of discs. This source is energized either by heat or electron bombardment. When energized, some of the gold atoms from the solid source are dislodged and suspended evenly around the surface of the part in an inert gas, often argon. This method of thin film deposition is particularly useful for viewing fine features on small parts when observed through an electron microscope.
Gold is chosen for sputtering due to the exceptional properties of sputtered gold films. These films are hard, durable, corrosion-resistant, and resistant to tarnishing. They maintain their sheen for a long time and do not rub off easily, making them ideal for applications in the watch and jewelry industry. Additionally, gold sputtering allows for fine-grain control over the deposition process, enabling the creation of uniform coatings or custom patterns and shades, such as rose gold, which requires a specific mix of gold and copper along with controlled oxidation of the free metal atoms during the sputtering process.
Overall, gold sputtering is a versatile and precise method for applying gold coatings, offering durability and aesthetic benefits while also being applicable in various industries including electronics and science.
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