Temperature has a significant effect on the deposition process and the quality of the deposited thin films.
1. Deposition Temperature:
The deposition temperature refers to the temperature of the substrate during the deposition process. Higher deposition temperatures lead to more stable MoS2 films. The film stability increases with the deposition temperature, and 200 °C is considered an inflection point for film stability. The temperature also affects the structure of the films, mainly related to sulfur and the growth mechanism of the films.
2. Substrate Temperature:
The substrate temperature during the deposition process affects the quality of the film. Increasing the substrate temperature helps compensate for suspended bonds on the film's surface, resulting in a decrease in the defect density of the film. The higher the substrate temperature, the denser the film, and the surface reaction is enhanced, improving the composition of the film.
3. Stress of Thin Films:
The stress of the deposited thin films can be calculated using the formula: σ = E x α x (T - T0), where σ is the stress of the thin film, E is the Young's modulus of the thin film material, α is the coefficient of thermal expansion of the thin film material, T is the substrate temperature, and T0 is the coefficient of thermal expansion of the substrate material. The substrate temperature affects the stress in the thin films.
4. Deposition Rate:
The deposition rate is the rate at which the sputtered material is deposited onto the substrate. It affects the thickness and uniformity of the deposited thin films. The deposition rate can be optimized to achieve the desired film thickness and uniformity.
In addition to temperature, other factors such as working pressure, adhesion properties, binding energy between the target and the substrate, energy of the impinging species, activation energies of adsorption, desorption, and thermal diffusion also influence the nucleation density and the average nucleus quantity during the deposition process.
It is important to consider contamination during the deposition process. Contamination can occur from residual gases in the deposition chamber, impurities in source materials, and contaminants on the substrate surface. Minimizing contamination requires a clean deposition environment and high-purity source materials.
Substrate compatibility is also crucial. The choice of substrate material can affect the characteristics and adherence of the thin film. Certain deposition processes may not be compatible with all materials, and some materials may undergo undesired reactions during the deposition process. Selecting a substrate material that can withstand the deposition conditions and interact appropriately with the thin film material is important.
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