Sputtering is a process used in physical vapor deposition (PVD). It involves ejecting atoms from a solid target material into the gas phase. This is done by bombarding the target with energetic ions. Sputtering is widely used for thin-film deposition and in analytical techniques.
What is a Sputtering System? – 6 Key Steps Explained
1. Vacuum Chamber Setup
The process starts by placing the substrate, which needs coating, inside a vacuum chamber. This chamber is then filled with an inert gas, usually argon. Argon does not react with the materials involved in the process.
2. Ionization of Gas
The target material is negatively charged, making it a cathode. This negative charge causes free electrons to flow from the cathode. These free electrons collide with the argon gas atoms, knocking off electrons from the gas atoms and ionizing them.
3. Sputtering Mechanism
The ionized gas atoms, now positively charged, are attracted towards the negatively charged target (cathode). They are accelerated by the electric field. When these high-energy ions collide with the target, they dislodge atoms or molecules from the target's surface. This process is known as sputtering.
4. Deposition of Thin Film
The ejected target material atoms form a vapor stream that travels through the chamber. They deposit onto the substrate, creating a thin film on the substrate. This deposition occurs at the atomic level.
5. Types of Sputtering Systems
There are several types of sputtering systems, including ion beam sputtering, diode sputtering, and magnetron sputtering. Each type differs in how the ions are generated and directed towards the target. However, the fundamental sputtering mechanism remains the same.
6. Magnetron Sputtering
In magnetron sputtering, a high voltage is applied across a low-pressure gas to create a high-energy plasma. This plasma emits a glow discharge, consisting of electrons and gas ions. This enhances the sputtering process by increasing the ionization rate of the gas.
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