Tech Team · Kintek Solution

The process of a furnace in semiconductor manufacturing involves several critical steps, primarily focused on achieving precise thermal conditions for material processing. Furnaces are used for tasks such as annealing, oxidation, diffusion, and chemical vapor deposition (CVD). These processes require controlled environments to ensure uniform heating, minimal contamination, and high energy efficiency. Key components like induction coils, muffle designs, and insulation play a vital role in maintaining the required temperatures and conditions. Additionally, automation and specialized designs, such as material trucks and burner bottoms, enhance operational efficiency and material handling.

Key Points Explained:

1. Induction Heating in Furnaces:

   • Induction furnaces, such as those used in Vacuum Induction Melting (VIM), generate electromagnetic fields to induce eddy currents within the metal. This method is highly efficient and capable of reaching the high temperatures necessary for melting metals and alloys.
   • The metal charge acts as the secondary winding of a transformer. When the induction coil is powered by an AC supply, it creates an alternating magnetic field, inducing an electromotive force and generating heat to melt the charge.

2. Material Handling and Automation:

   • Semiconductor furnaces often use double material trucks for cyclic charging and loading operations. These systems are designed for automated control, ensuring smooth entry and exit of material vehicles.
   • Hydraulic systems are employed for lifting and lowering material vehicles, while burner bottoms facilitate slag cleaning, improving operational efficiency.

3. Muffle Furnace Design:

   • Muffle furnaces feature a chamber designed with furnace racks to hold materials according to production needs. This design ensures materials are fully processed, whether for annealing, oxidation, or other thermal treatments.
   • The furnace door can be customized to open in various directions (downward, upward, or sideways) based on specific requirements, enhancing usability and accessibility.

4. Insulation and Temperature Control:

   • Insulation in muffle furnaces surrounds the muffle to maintain a constant internal temperature. This minimizes heat loss, improves energy efficiency, and ensures uniform heating of materials.
   • Effective insulation is critical for processes like semiconductor annealing, where precise temperature control is essential for material properties.

5. Role of Dry Hydrogen in Semiconductor Processing:

   • Dry hydrogen is used in semiconductor furnaces to reduce metal oxides when heated to high temperatures. It converts metal oxides back to their native form while forming water, creating ideal conditions for processes like brazing.
   • This ensures strong bonds between materials and prevents contamination, which is crucial for semiconductor manufacturing.

6. Temperature and Melting Processes:

   • In semiconductor furnaces, temperatures can reach up to 1650°C, as seen in steel manufacturing processes. The liquid metal is then tapped into ladles for further processing, ensuring consistent quality and properties.
   • High-temperature capabilities are essential for processes like diffusion and CVD, where precise thermal conditions are required for material deposition and doping.

By integrating these components and processes, semiconductor furnaces achieve the precision and efficiency needed for advanced manufacturing. The combination of induction heating, automated material handling, and controlled environments ensures high-quality semiconductor production.

Summary Table:

Key Process	Description
Induction Heating	Uses electromagnetic fields to induce eddy currents, melting metals efficiently.
Material Handling	Automated systems with double material trucks and hydraulic controls.
Muffle Furnace Design	Customizable chambers and doors for precise material processing.
Insulation	Maintains constant temperature, ensuring energy efficiency and uniform heating.
Dry Hydrogen Use	Reduces metal oxides, preventing contamination in semiconductor processes.
High-Temperature Melting	Reaches up to 1650°C for processes like diffusion and CVD.

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