The sputtering process of plasma involves using a plasma environment to eject atoms from the surface of a target material.
These atoms are then deposited onto a substrate to form a thin film.
This process is a type of physical vapor deposition (PVD) and is commonly used in various applications such as optics and electronics.
What is the Sputtering Process of Plasma? 4 Key Steps to Understand
Formation of Plasma
The process begins by introducing a noble gas, typically argon, into a vacuum chamber.
The pressure inside the chamber is maintained at a specific level, usually up to 0.1 Torr.
A DC or RF power source is then used to ionize the gas, creating a plasma.
This plasma consists of neutral gas atoms, ions, electrons, and photons in near equilibrium.
The energy from the plasma is transferred to the surrounding area.
Sputtering Mechanism
In the sputtering process, the target material is exposed to the plasma.
The gas atoms in the plasma become positively charged ions by losing electrons.
These ions are accelerated by the electric field within the plasma and gain sufficient kinetic energy.
When these energetic ions strike the target, they dislocate atoms or molecules from the target material.
This ejection of material from the target is known as sputtering.
Deposition of Material
The sputtered material forms a vapor stream that travels through the chamber and eventually strikes a substrate.
Upon impact, the material adheres to the substrate, forming a thin film or coating.
The rate at which material is sputtered from the target, known as the sputtering rate, is influenced by several factors.
These factors include the sputter yield, molar weight of the target, material density, and ion current density.
Applications
Sputtering is utilized in various scientific and industrial applications where thin films of specific materials are required.
It is particularly useful in the fields of optics and electronics, where precise and controlled deposition of materials is crucial.
This process is not only applicable in controlled environments like laboratories and industries but also occurs naturally in outer space.
It contributes to phenomena such as the formation of the universe and the corrosion of spacecraft.
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