Vacuum Cold Mounting Machine for Sample Preparation

Application: Precision Sample Preparation for Advanced Laboratory Analysis

The Vacuum Cold Mounting Machine is engineered to address critical challenges in sample preparation, particularly for porous, fragile, or irregularly shaped materials. Its primary application lies in creating high-quality, void-free mounts for metallographic, electronic, and industrial failure analysis.

Key Applications Include:

• Circuit Board Inspection: Ensures flawless encapsulation of delicate microelectronic components, enabling precise cross-sectional analysis of solder joints, traces, and layered structures.
• Failure Analysis: Ideal for preparing crack-sensitive samples, such as fractured metal parts or composite materials, without introducing heat-induced distortions.
• Geological & Ceramic Studies: Effectively infiltrates porous ores, ceramics, and sprayed coatings to preserve structural integrity during grinding and polishing.
• Aerospace & Automotive Materials: Prepares composite materials, castings, and turbine blade coatings for microscopic examination by eliminating air pockets in fibrous or layered structures.
• Quality Control in Manufacturing: Used with dyes to detect microcracks, porosity, or delamination in cast parts, welded joints, or 3D-printed components.

This machine excels in scenarios where traditional hot-mounting methods would compromise sample integrity. Laboratories specializing in materials science, electronics manufacturing, or industrial R&D will find it indispensable for preparing samples for SEM/EDS, FTIR spectroscopy, or metallurgical microscopy.

Feature: Advanced Engineering for Unmatched Efficiency

The Vacuum Cold Mounting Machine combines robust construction with intelligent design to streamline the mounting process:

Core Features:

• 8-Station Simultaneous Processing: Mount multiple samples in a single cycle using the Φ205mm rotating disk, dramatically reducing turnaround time for batch analysis.
• Precision Vacuum Control: Achieves -0.08MPa vacuum levels to thoroughly degas samples and resin mixtures, preventing bubble formation in final mounts.
• Bi-directional Rotation System: The forward/reverse rotating vacuum chamber ensures even resin distribution, critical for angular or recessed specimens.
• Industrial-Grade Components: Oil-free vacuum pump maintains consistent performance while eliminating contamination risks in cleanroom environments.
• Adaptable Mold Compatibility: Accommodates standard and custom mounting cups (6 included) for specimens ranging from 10mm to 50mm in diameter.

The machine’s compact footprint (350×350×380mm) and 14kg weight make it suitable for benchtop use, while the Φ280×330mm chamber accommodates large-scale industrial components.

Principle: Scientifically Optimized Encapsulation Process

The machine operates on a proven three-stage vacuum impregnation methodology:

Operational Workflow:

1. Vacuum Degassing: Removes trapped air from sample pores and resin mixture, achieving 99.9% void elimination.
2. Atmospheric Pressure Infiltration: Harnesses 101.3kPa atmospheric force to drive resin into sub-micron cavities unreachable by manual methods.
3. Controlled Polymerization: Maintains optimal pressure during curing to prevent resin shrinkage or debonding.

This physics-driven approach ensures complete encapsulation of:

• Microcracks down to 0.1μm width
• Multi-layer PCB vias and through-holes
• Interconnected porosity in cast alloys
• Fracture networks in geological specimens

By eliminating thermal stress and mechanical vibration, the process preserves delicate nanostructures critical for accurate analytical results.

Advantage: Transformative Benefits for Analytical Accuracy

Compared to conventional mounting techniques, this system delivers measurable improvements in workflow efficiency and data reliability:

Strategic Advantages:

• 75% Time Reduction: Simultaneous processing of 8 specimens versus single-sample methods.
• 100% Repeatable Conditions: Programmable vacuum/pressure cycles ensure batch-to-batch consistency for ISO 17025 compliance.
• Superior Edge Retention: Maintains critical features at grinding interfaces for EBSD analysis.
• Multi-Material Compatibility: Works with epoxy, acrylic, and polyester resins for diverse applications.
• Cost Efficiency: Reduces resin waste by 40% through optimized impregnation versus manual methods.

For FTIR spectroscopy users, the machine produces uniform transmission pellets with optical-grade surfaces, achieving CV <2% in absorbance measurements. Its ability to handle irregular specimens minimizes cutting waste of precious materials – a critical advantage for rare geological samples or prototype electronics.

Contact our technical team to discuss customization options for your specific sample preparation challenges.

Technical specifications

Trusted by Industry Leaders