A vacuum system, as used in sputtering, is an essential component of a sputter coating system.
This system is used to deposit thin films of electrically conducting materials onto microcircuits or other substrates.
The vacuum system ensures that the process takes place in a controlled environment with minimal interference from contaminants.
4 Key Components You Need to Know
1. Vacuum Chamber
The vacuum system consists of a vacuum chamber, which is evacuated to a base pressure to remove any residual gas molecules.
These molecules include H2O, air, H2, and Ar.
The base pressure is typically in the high-vacuum range, around 10-6 mbar or better, to ensure clean surfaces and avoid contamination.
2. High-Purity Inert Process Gas
Once the chamber is evacuated, a high-purity inert process gas, usually argon, is introduced into the chamber.
This gas serves as the sputter gas and plays a crucial role in the sputtering process.
It conveys kinetic energy upon impact during high-energy molecular collisions in the plasma.
These collisions create the gas ions that are the primary driving force of sputter thin film deposition.
The pressure during sputter deposition is typically in the mTorr range, ranging from 10-3 to some 10-2 mbar.
3. Sputtering Process
The sputtering process itself involves applying a DC electrical current to the target coating material.
This material serves as the cathode or the negative bias point where electrons enter the system.
The substrate to be coated is also given a positive charge and becomes the anode.
The DC electrical current is usually in the range of -2 to -5 kV.
The sputter target, which is the material to be used as a coating, is placed in the vacuum chamber parallel to the substrate.
When the sputtering particles, which have high kinetic energy, hit the target surface, atoms from the target are "kicked" out and fly toward the substrate.
These atoms form a film on the substrate.
The particles from the target cover the substrate evenly and quickly.
The low temperature of the sputtered particles allows even heat-sensitive substrates like plastics to be coated with ceramics or metals.
4. Inert Gas Control
In some cases, if the substrate is very sensitive, the vacuum chamber can be filled to some degree with an inert gas.
This enables the control of the kinetic energy of the particles coming from the target.
These particles may undergo collisions and lose some of their velocity before being deposited on the substrate.
Overall, the vacuum system in sputtering is crucial for creating a controlled environment and ensuring the deposition of clean, uniform, and high-quality thin films on substrates.
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